Head of IC Package Design & Advanced Integration

Astera Labs; San Jose (CA); On-site; USD 230,000 - 265,000; Full time

Job summary

A leading semiconductor company in San Jose is seeking a Manager, Package Design Engineering to own the end-to-end delivery of advanced IC packaging solutions. The role involves building and mentoring a high-performing team and driving collaboration with silicon architecture and external partners. Candidates must have over 10 years of experience in IC package design and strong leadership capabilities. This position offers a competitive salary range of $230,000 to $265,000 and actively encourages diverse applicants.

Qualifications

• 10+ years of progressive experience in IC package design.
• Strong hands-on expertise in end-to-end package design.
• Experience with high-speed SerDes systems and advanced nodes.

Responsibilities

• Lead and scale a high-performing package design team.
• Own end-to-end package design execution.
• Drive technical tradeoffs across performance and cost.

Skills

IC package design

Leadership

End-to-end package design

Collaboration with OSATs

Design methodologies

Education

Bachelor's degree in Electrical Engineering

Tools

Cadence Allegro APD/SiP

Job description

A leading semiconductor company in San Jose is seeking a Manager, Package Design Engineering to own the end-to-end delivery of advanced IC packaging solutions. The role involves building and mentoring a high-performing team and driving collaboration with silicon architecture and external partners. Candidates must have over 10 years of experience in IC package design and strong leadership capabilities. This position offers a competitive salary range of $230,000 to $265,000 and actively encourages diverse applicants.