Package Architect – Advanced Packaging & System Exploration

Micron Technology; San Jose (CA); On-site; USD 177,000 - 387,000; Full time

Job summary

Micron Technology is seeking an experienced professional for a role focused on advanced package architectures and package-level simulation in San Jose, California. The ideal candidate will possess at least a Bachelor’s degree and 10+ years of experience in package design. Responsibilities include defining package architectures, running thermal simulations, and guiding architectural requirements. The position offers a competitive salary range from $177,000 to $387,000 annually.

Qualifications

• 10+ years of hands-on experience in package design or package-level simulation.
• Strong experience with package SI modeling and analysis.
• Ability to independently build models and drive conclusions.

Responsibilities

• Define and explore advanced package architectures for future memory systems.
• Perform package-level trade-off studies across SI, PI, thermals, cost, and scalability.
• Create hands-on package designs and models for early feasibility analysis.

Skills

Package design

Package-level simulation

SI modeling and analysis

Thermal simulations

Education

Bachelor’s degree in EE, ME, Materials, or related field

Master’s degree in a related technical field

Job description

Responsibilities

• Define and explore advanced package architectures for future memory systems
• Perform package‑level trade‑off studies across SI, PI, thermals, cost, and scalability
• Create hands‑on package designs and models for early feasibility analysis
• Run SI/PI and thermal simulations and translate results into architecture guidance
• Define package requirements and act as extension architecture and engineering

Minimum Qualifications

• Bachelor’s degree or equivalent practical experience in EE, ME, Materials, or related field
• 10+ years of hands‑on experience in package design or package‑level simulation
• Strong experience with package SI modeling and analysis
• Ability to independently build models and drive conclusions

Preferred Qualifications

• Master’s degree in a related technical field
• Experience supporting architecture or pre‑silicon exploration teams
• Familiarity with system‑level co‑design across silicon, package, and board
• Experience with multi‑die or heterogeneous integration

Salary: $177,000.00 - $387,000.00 a year

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.