Package Architect – Advanced Packaging & System Exploration

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 177,000 - 387,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Paid time-off program

Job summary

1000 Micron Technology, Inc. in Boise, ID is seeking an experienced engineer to define and explore advanced package architectures for next-gen memory systems. You will perform critical trade-off studies, create hands-on package designs, and run simulations for SI/PI and thermal analysis.

The ideal candidate has over 10 years of experience in package design with a Bachelor’s degree in Engineering. The position offers a competitive salary range of $177,000 - $387,000, along with comprehensive benefits that include medical, dental, vision plans, and paid time-off.

Qualifications

• 10+ years of hands-on experience in package design or package-level simulation.
• Ability to independently build models and drive conclusions.

Responsibilities

• Define and explore advanced package architectures for future memory systems.
• Perform package-level trade-off studies across SI, PI, thermals, cost, and scalability.
• Run SI/PI and thermal simulations and translate results into architecture guidance.

Skills

Package design expertise

SI modeling and analysis

Thermal simulation

Education

Bachelor’s degree in EE, ME, Materials, or related field

Master’s degree in a related technical field

Job description

Responsibilities

• Define and explore advanced package architectures for future memory systems
• Perform package‑level trade‑off studies across SI, PI, thermals, cost, and scalability
• Create hands‑on package designs and models for early feasibility analysis
• Run SI/PI and thermal simulations and translate results into architecture guidance
• Define package requirements and act as extension architecture and engineering

Minimum Qualifications

• Bachelor’s degree or equivalent practical experience in EE, ME, Materials, or related field
• 10+ years of hands‑on experience in package design or package‑level simulation
• Strong experience with package SI modeling and analysis
• Ability to independently build models and drive conclusions

Preferred Qualifications

• Master’s degree in a related technical field
• Experience supporting architecture or pre‑silicon exploration teams
• Familiarity with system‑level co‑design across silicon, package, and board
• Experience with multi‑die or heterogeneous integration

Salary: $177,000.00 - $387,000.00 per year. Additional compensation may include benefits, bonuses and equity.

Benefits: Micron offers medical, dental and vision plans, income protection, paid family leave, paid time‑off program and holidays. Benefit details are available on the Micron careers benefits guide.

EEO Statement: Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.