SMTS Design Engineer, Bonding and Packaging

Micron Technology; Boise (ID); On-site; USD 150,000 - 210,000; Full time

Job summary

Micron Technology is seeking a highly experienced Design Engineer for the Advanced Packaging Technology Development (APTD) team in Boise, Idaho. You will lead electrical, thermal, and thermo-mechanical design for next‑gen semiconductor packages including HBM, W2W, and TSV, collaborating with global teams and leveraging AI to accelerate simulations and data‑driven decisions.

The role requires 15–20 years in engineering with at least 10 in packaging analysis, strong skills in parasitics and

Qualifications

• MS or PhD in Electrical Engineering, Materials Science, or related field.
• 15–20 years of professional experience with at least 10 years in electrical, thermal, and mechanical package analysis and validation in semiconductor packaging.
• Strong understanding of thermal impedance and packaging impacts on thermal performance.
• Proficiency with DOE and statistical analysis tools (e.g., JMP).
• Experience integrating AI/ML tools into engineering workflows and design processes.

Responsibilities

• Maintain deep knowledge of semiconductor and advanced electronics packaging (HBM, W2W, COW, Flip Chip, TSV).
• Drive design advancements through analysis of parasitics, insertion loss, impedance mismatches across materials and geometries.
• Propose short- and long-term solutions to improve thermal performance and align with roadmaps.
• Apply Chip-Package Interaction understanding in 2.5D/3D systems and drive validation of mechanical/thermo-mechanical models.
• Collaborate with vendors and test labs to design procedures for dielectric constants and decay value characterization.
• Integrate AI workflows into package design and evaluation to advance AI-enabled technology development.

Skills

Electrical engineering

Thermal analysis

AI/ML in design

Design for reliability

Education

MS/PhD in EE or Materials

Tools

Cadence

MATLAB

JMP

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of cutting‑edge memory and storage solutions that power the AI era. We work hands‑on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production‑ready technologies. We thrive on innovation and collaboration!

We are seeking a highly experienced Design Engineer to enable our APTD team in the Bonding & Packaging Design space. In this role you will drive the electrical, thermal, and thermo‑mechanical design and characterization of next‑generation semiconductor packages, including High Bandwidth Memory (HBM), wafer‑to‑wafer (W2W), Chip‑on‑Wafer (COW), Flip Chip, and Through‑Silicon‑Via (TSV) technologies. You will work closely with global multidisciplinary teams to turn complex simulation results into practical design guidelines and future technology roadmaps. A key focus of the role is leveraging AI and machine learning tools, including generative AI and predictive analytics to improve learning, accelerate simulations, and enable data‑driven decision making within Advanced Packaging R&D.

Job Responsibilities

• Maintain deep subject‑matter knowledge of semiconductor and advanced electronics packaging technologies such as HBM, W2W, COW, Flip Chip, and TSV
• Drive design advancements through a detailed understanding of electrical parasitics, insertion loss, and impedance mismatches of various interconnects as a function of materials, geometries, temperature, and humidity, capturing the corresponding multiphysics mechanisms in simulation
• Propose short and long‑term solutions to improve thermals and kick off projects aligned to thermal improvement roadmaps.
• Apply understanding of Chip‑Package Interactions (CPI) in 2.5D, 3D systems, and internal qual packages; drive sensitivity studies and data collection to validate mechanical and thermo‑mechanical stress/strain structural models; Propose design rules with clear justification and explanation for partnering teams.
• Work with internal/external vendors and testing labs to design and implement effective testing procedures to characterize material dielectric constants and decay values for simulation analysis.
• Integrate AI workflows into package design and package technology evaluations and creation; Drive AI‑enabled technology development for advanced packaging and heterogeneous integration.

Minimum Qualifications

• MS or Ph.D. in Electrical Engineering, Material Science, Applied Physics, or a related field
• 15–20 years of professional experience in a relevant engineering area with at least 10 years of direct experience in electrical, thermal, and mechanical package analysis, modeling, and validation of electronic packages in the semiconductor industry or equivalent.
• Solid understanding of design and process impacts on thermal performance, including the contribution of each layer to total thermal impedance
• Proficiency with engineering tools for Design of Experiments (DOE) and statistical analysis (e.g., JMP or equivalent)
• Demonstrated ability to integrate AI/ML and generative AI tools into engineering workflows, technical assessments, and daily productivity

Preferred Qualifications

• Experience in Signal Integrity analysis and high‑speed package designs, defining characterization (CHAR) plans, and defining DOEs needed to develop package solutions for specific problems
• Familiarity with Cadence layout tools to open and review designs of test vehicles or new memory concepts
• Data acquisition experience and numerical analysis proficiency in MATLAB, Excel, JMP, etc.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.