Senior Package Architect — Early-Phase System Exploration

Micron Technology, Inc; Boise (ID); On-site; USD 177,000 - 387,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Paid time-off program

Job summary

A leading semiconductor company in Boise, Idaho is seeking a Package Architect to explore advanced packaging architectures for future memory systems. This role involves hands-on design, modeling, and simulating package concepts, focusing on package-level trade-offs, simulations, and defining requirements. The ideal candidate should have a Bachelor's degree with 10+ years of experience in package design or simulation, and strong SI modeling skills. A Master's degree and experience in pre-silicon exploration are preferred.

Qualifications

• 10+ years of hands-on experience in package design or package-level simulation.
• Strong experience with package SI modeling and analysis.
• Ability to independently build models and drive conclusions.

Responsibilities

• Define and explore advanced package architectures for future memory systems.
• Perform package-level trade-off studies across SI, PI, thermals, cost, and scalability.
• Run SI/PI and thermal simulations and translate results into architecture guidance.

Skills

Package design

Package-level simulation

SI modeling

Education

Bachelor's degree in EE, ME, Materials or related field

Master's degree in a related technical field

Job description

A leading semiconductor company in Boise, Idaho is seeking a Package Architect to explore advanced packaging architectures for future memory systems. This role involves hands-on design, modeling, and simulating package concepts, focusing on package-level trade-offs, simulations, and defining requirements. The ideal candidate should have a Bachelor's degree with 10+ years of experience in package design or simulation, and strong SI modeling skills. A Master's degree and experience in pre-silicon exploration are preferred.