Senior MTS Design Engineer: AI-Driven Packaging

Micron Technology, Inc; Boise (ID); On-site; USD 150,000 - 230,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. is seeking a highly experienced Design Engineer to lead electrical, thermal, and thermo‑mechanical design for next‑generation semiconductor packages such as HBM, W2W, COW, Flip Chip, and TSV.

You will leverage AI and predictive analytics to accelerate simulations and guide data‑driven decisions within the Advanced Packaging R&D group. The role demands 15–20 years in engineering with at least 10 years in package analysis and a strong background in AI/ML integration.

Qualifications

• MS or PhD in Electrical Engineering, Materials Science, Applied Physics, or a related field.
• 15–20 years of professional experience in a relevant engineering area with at least 10 years of direct experience in electrical, thermal, and mechanical package analysis, modeling, and validation of electronic packages in the semiconductor industry or equivalent.
• Proficiency with DOE and statistical analysis (JMP or equivalent).
• Demonstrated ability to integrate AI/ML tools into engineering workflows.

Responsibilities

• Maintain deep subject‑matter knowledge of semiconductor and advanced electronics packaging technologies such as HBM, W2W, COW, Flip Chip, and TSV.
• Drive design advancements through understanding electronic parasitics, insertion loss, and impedance mismatches in interconnects during simulations.
• Propose short and long‑term solutions to improve thermals and initiate thermal improvement roadmaps.
• Apply Chip‑Package Interaction concepts in 2.5D/3D systems and drive validation of mechanical models.
• Work with vendors to design/testing procedures to characterize material dielectric constants and decay values.
• Integrate AI workflows into package design and evaluation; drive AI-enabled technology development.

Skills

Semiconductor packaging

Electrical analysis

Thermal analysis

AI/ML in design

DOE & statistics

Education

MS or PhD in Electrical Engineering, Materials Science, Applied Physics

Tools

Cadence

MATLAB

JMP

Excel

Job description

Micron Technology, Inc. is seeking a highly experienced Design Engineer to lead electrical, thermal, and thermo‑mechanical design for next‑generation semiconductor packages such as HBM, W2W, COW, Flip Chip, and TSV.

You will leverage AI and predictive analytics to accelerate simulations and guide data‑driven decisions within the Advanced Packaging R&D group. The role demands 15–20 years in engineering with at least 10 years in package analysis and a strong background in AI/ML integration.