Senior HBM Design Engineer for AI & HPC Systems

Micron Technology, Inc; Richardson (TX); On-site; USD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. is seeking a Sr Design Engineer, HBM to join the Heterogeneous Integration Group. You will contribute to architecture-driven design for High Bandwidth Memory products used in AI/ML and HPC systems.

You will collaborate with DE, PSE, TD and packaging teams to drive silicon issues to closure, support product lifecycles, and help optimize yield and reliability across designs.

Qualifications

• Strong understanding of DRAM/HBM architecture and high-speed memory interfaces.
• Experience in digital and/or custom design and verification.
• Hands-on experience in silicon debug or post-silicon validation.
• Proficiency in Artificial Intelligence concepts to improve design quality and efficiency.

Responsibilities

• HBM Design & Architecture: Collaborate on new HBM product design with architecture team.
• Product Sustaining: Own and support one or more products through lifecycle, handling ECOs and changes.
• Cross-Functional Collaboration: Work with Architect, DE, PSE, TD and system teams to resolve issues.
• Quality & Yield: Debug yield, reliability and performance issues to improve product quality.
• Customer Support: Assist with customer bring-up, qualification and system-level debugging.
• Continuous Improvement: Share learnings to improve design quality and verification methods.

Skills

DRAM/HBM architecture

Digital design

Verification

Silicon debug

AI in design

Education

Ph.D or MS (Electrical/Computer Eng)

Job description

Micron Technology, Inc. is seeking a Sr Design Engineer, HBM to join the Heterogeneous Integration Group. You will contribute to architecture-driven design for High Bandwidth Memory products used in AI/ML and HPC systems.

You will collaborate with DE, PSE, TD and packaging teams to drive silicon issues to closure, support product lifecycles, and help optimize yield and reliability across designs.