Principal Engineer - Advanced Packaging Innovation

Micron Technology, Inc; Boise (ID); On-site; USD 100,000 - 140,000; Full time

Job summary

Micron Technology, Inc in Boise is looking for a Principal Engineer in Advanced Package Technology Development. In this role, you will lead innovation efforts through strategic leadership, influencing the development of packaging technologies and ensuring alignment with business objectives.

Applicants should possess over 5 years of experience in semiconductor advanced packaging and a relevant degree. The position offers a dynamic environment focused on driving technological advancements and business value.

Qualifications

• Over 5 years of professional experience in semiconductor advanced packaging.
• Deep knowledge of High Bandwidth Memory, and emerging 3D integration strategies including Hybrid bonding.
• Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process.

Responsibilities

• Deliver high-value technology solutions and drive technical innovation.
• Collaborate with internal and external partners for technology integration.
• Define packaging technology roadmaps and assess competitive metrics.

Skills

Professional experience in semiconductor advanced packaging

Knowledge of High Bandwidth Memory

Process module engineering experience

Experience in DRAM manufacturing

Education

BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, or related field

Job description

Micron Technology, Inc in Boise is looking for a Principal Engineer in Advanced Package Technology Development. In this role, you will lead innovation efforts through strategic leadership, influencing the development of packaging technologies and ensuring alignment with business objectives.

Applicants should possess over 5 years of experience in semiconductor advanced packaging and a relevant degree. The position offers a dynamic environment focused on driving technological advancements and business value.