Senior Advanced Packaging Engineer - 2.5D/3D & AI/HPC

Accroid Inc; Phoenix (AZ); On-site; USD 140,000 - 190,000; Full time

Job summary

Accroid Inc. is seeking a senior packaging engineer with deep expertise in advanced semiconductor packaging. You will lead design efforts for 2.5D/3D systems, chiplet architectures, and heterogeneous integration, collaborating with OSATs and foundries through concept to production.

Candidates should command thermal, mechanical, and electrical package design, drive reliability and yield improvements, and support AI/HPC semiconductor products with robust packaging solutions.

Qualifications

• 7+ years of experience in advanced semiconductor packaging and related activities.
• Hands-on with 2.5D and 3D packaging technologies in product programs.
• Deep knowledge of chiplet architectures and heterogeneous integration.
• Experience in multi-die package design, silicon interposers, TSV, and advanced substrate tech.
• Proven ability to support AI/HPC semiconductor products from concept through production.
• Strong familiarity with package assembly, reliability, yield improvement, and qualification.
• Experience collaborating with OSATs and semiconductor foundries.
• Solid understanding of thermal, mechanical, and electrical aspects of package design.

Responsibilities

• Lead advanced packaging design projects from concept through production.
• Collaborate with OSATs and foundries on process development.
• Evaluate thermal, mechanical, and electrical performance of packages.
• Support AI/HPC semiconductor products with robust packaging solutions.

Skills

Semiconductor packaging experience

2.5D packaging

3D packaging

Chiplet architectures

Heterogeneous integration

Multi-die package design

Silicon interposers

TSV

Advanced substrate technologies

AI/HPC product support

Package assembly & reliability

Yield improvement & qualification

OSATs & foundries collaboration

Thermal, mechanical, electrical design

Education

Bachelor's degree in Electrical Engineering

Bachelor's degree in Mechanical Engineering

Bachelor's degree in Materials Science

Bachelor's degree in Physics

Tools

Cadence Allegro

Siemens Xpedition Package Designer

Job description

Accroid Inc. is seeking a senior packaging engineer with deep expertise in advanced semiconductor packaging. You will lead design efforts for 2.5D/3D systems, chiplet architectures, and heterogeneous integration, collaborating with OSATs and foundries through concept to production.

Candidates should command thermal, mechanical, and electrical package design, drive reliability and yield improvements, and support AI/HPC semiconductor products with robust packaging solutions.