Senior IC Substrate Layout Engineer — Equity Eligible

NVIDIA Corporation; Santa Clara (CA); On-site; USD 136,000 - 258,750; Full time

Job summary

NVIDIA Corporation in Santa Clara, California is looking for a Senior Package Layout Engineer to lead the design of detailed layouts for IC substrates. You will collaborate with design teams to resolve issues and optimize high-speed ASIC packages.

The ideal candidate has over 5 years of experience in PCB layout on technologies like graphics cards and motherboards, with a strong background in tools like Cadence APD. This role offers competitive compensation and equity benefits.

Qualifications

• 5+ years of PCB layout experience on graphics cards, motherboards, or related technology.
• Experience with HDI designs is a plus.
• Proven experience in substrate layout of wire-bond and flip-chip packages.

Responsibilities

• Collaborate with design teams to develop detailed IC substrate layouts.
• Plan schedules and resolve design issues with teams.
• Perform substrate breakout patterns for ASIC packages.

Skills

PCB layout experience on graphics cards, motherboards

High-density interconnect (HDI) designs

Cadence APD or SiP tools

Signal integrity practices

Education

B.S. in Electrical Engineering or equivalent experience

Tools

Cadence APD

Valor

Virtuoso

Calibre

Job description

NVIDIA Corporation in Santa Clara, California is looking for a Senior Package Layout Engineer to lead the design of detailed layouts for IC substrates. You will collaborate with design teams to resolve issues and optimize high-speed ASIC packages.

The ideal candidate has over 5 years of experience in PCB layout on technologies like graphics cards and motherboards, with a strong background in tools like Cadence APD. This role offers competitive compensation and equity benefits.