Senior IC Substrate & Package Layout Engineer

NVIDIA Gruppe; Santa Clara (CA); On-site; USD 136,000 - 258,750; Full time

Job summary

NVIDIA Gruppe is looking for a skilled PCB Layout Engineer to engage in the design and development of advanced IC substrates. The ideal candidate will have 5+ years of relevant experience and a strong background in high-speed design using Cadence APD tools.

This position is based in Santa Clara, California, with a salary range of $136,000 to $212,750 for Level 3, and $168,000 to $258,750 for Level 4, plus benefits. NVIDIA values diversity and is an equal opportunity employer.

Qualifications

• 5+ years experience in PCB Layout of graphics cards, motherboards, or related technology.
• Proven substrate layout experience of wire bond and flip chip packages.
• Solid understanding of high-speed design signal integrity practices.

Responsibilities

• Collaborate with design teams on IC substrate layout.
• Plan schedules and resolve manufacturing issues.
• Design high speed/density ASIC packages.

Skills

PCB Layout

Cadence APD

Electrical Design

High-speed design

Signal integrity

Education

B.S. Electrical Engineering

Tools

SiP

Virtuoso

Calibre

Valor

Job description

NVIDIA Gruppe is looking for a skilled PCB Layout Engineer to engage in the design and development of advanced IC substrates. The ideal candidate will have 5+ years of relevant experience and a strong background in high-speed design using Cadence APD tools.

This position is based in Santa Clara, California, with a salary range of $136,000 to $212,750 for Level 3, and $168,000 to $258,750 for Level 4, plus benefits. NVIDIA values diversity and is an equal opportunity employer.