Senior IC Package Layout Engineer – High-Speed GPU Hardware

NVIDIA; Oregon (WI); On-site; USD 136,000 - 258,750; Full time

Job summary

A leading technology firm is seeking a Senior Package Layout Engineer to design and develop detailed layouts of IC substrates. The role involves collaboration with technical teams to enhance design productivity and resolve technical issues. Qualifications include a B.S. in Electrical Engineering and 5+ years in PCB Layout. Strong skills in Cadence APD are essential. The position offers a competitive salary range of $136,000 - $258,750 based on level and experience.

Qualifications

• 5+ years of experience in PCB Layout of graphics cards and related technology.
• Proven experience in substrate layout of wire bond and flip chip packages.
• Significant background with PCB layout tools including Constraint Manager.

Responsibilities

• Collaborate to implement high speed/density ASIC packages.
• Optimize package pinout incorporating system level trade-offs.
• Develop methodologies to improve layout productivity.

Skills

PCB Layout

Cadence APD

Signal integrity

High-speed design

Education

B.S. Electrical Engineering or equivalent experience

Tools

Cadence APD

Virtuoso

Valor

Job description

A leading technology firm is seeking a Senior Package Layout Engineer to design and develop detailed layouts of IC substrates. The role involves collaboration with technical teams to enhance design productivity and resolve technical issues. Qualifications include a B.S. in Electrical Engineering and 5+ years in PCB Layout. Strong skills in Cadence APD are essential. The position offers a competitive salary range of $136,000 - $258,750 based on level and experience.