Senior Package Layout Engineer - Hardware

NVIDIA Gruppe; Santa Clara (CA); On-site; USD 136,000 - 258,750; Full time

Job summary

NVIDIA Gruppe is looking for a skilled PCB Layout Engineer to engage in the design and development of advanced IC substrates. The ideal candidate will have 5+ years of relevant experience and a strong background in high-speed design using Cadence APD tools.

This position is based in Santa Clara, California, with a salary range of $136,000 to $212,750 for Level 3, and $168,000 to $258,750 for Level 4, plus benefits. NVIDIA values diversity and is an equal opportunity employer.

Qualifications

• 5+ years experience in PCB Layout of graphics cards, motherboards, or related technology.
• Proven substrate layout experience of wire bond and flip chip packages.
• Solid understanding of high-speed design signal integrity practices.

Responsibilities

• Collaborate with design teams on IC substrate layout.
• Plan schedules and resolve manufacturing issues.
• Design high speed/density ASIC packages.

Skills

PCB Layout

Cadence APD

Electrical Design

High-speed design

Signal integrity

Education

B.S. Electrical Engineering

Tools

SiP

Virtuoso

Calibre

Valor

Job description

Responsibilities

• Collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products.
• Plan schedules, resolve costs, manufacturing, and electrical design issues.
• Design high speed/density ASIC packages.
• Perform substrate breakout patterns for ASIC packages.
• Optimize package pinout incorporating system level trade-offs of pins assignment.
• Perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
• Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
• Develop symbols and CAD library databases using Cadence APD design tools.
• Develop methodologies to improve layout productivity.

Requirements

• Hold a B.S. Electrical Engineering or equivalent experience.
• 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus.
• Proven experience in substrate layout of wire bond and flip chip packages, preferred.
• Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager).
• Solid understanding of high-speed design signal integrity practices.
• Experience with Virtuoso and Calibre is a plus.
• Experience using Valor is helpful.

Salary and Benefits

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is $136,000 USD - $212,750 USD for Level 3, and $168,000 USD - $258,750 USD for Level 4. You will also be eligible for equity and benefits.

NVIDIA uses AI tools in its recruiting processes.

NVIDIA is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.