Senior Package Layout Engineer - Hardware

Nvidia Corporation in; Santa Clara (CA); On-site; USD 130,000 - 180,000; Full time

Job summary

NVIDIA is seeking a Senior Package Layout Engineer for Hardware to design and optimize complex IC substrates for GPUs and SOCs. You will work with design teams to plan schedules, resolve manufacturing and electrical design issues, and contribute to high-density package solutions.

Responsibilities include substrate layout, pinout optimization, and developing CAD libraries using Cadence tools to enhance layout productivity.

Qualifications

• BS in Electrical Engineering or equivalent.
• 5+ years of PCB layout experience for graphics cards, motherboards, line cards or related technology.
• Experience with HDI designs is a plus.
• Proven experience in substrate layout of wire bond and flip chip packages is preferred.

Responsibilities

• Collaborate to implement high speed/density ASIC packages.
• Perform substrate breakout patterns for ASIC packages.
• Optimize package pinout with system-level trade-offs of pins assignment.
• Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
• Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
• Develop symbols and CAD library databases using Cadence APD design tools
• Develop methodologies to improve layout productivity

Skills

PCB Layout

HDI designs

Wire bond/flip chip

Education

BS in Electrical Engineering

Tools

Cadence APD

SiP tool suite

Job description

Senior Package Layout Engineer - Hardware (Finance)

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions!

This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.

What you'll be doing:

• As part of a Layout team, you will collaborate to implement high speed/density ASIC packages.
• Perform substrate breakout patterns for ASIC packages.
• Optimize package pinout incorporating system level trade-offs of pins assignment.
• Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
• Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
• Develop symbols and CAD library databases using Cadence APD design tools
• Develop methodologies to improve layout productivity

What we need to see:

• Hold a B.S. Electrical Engineering or equivalent experience
• 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus
• Proven experience in substrate layout of wire bond and flip chip packages, preferred