Senior Package Layout Engineer - Remote & Hybrid Equity

NVIDIA Corporation; Santa Clara (CA); Hybrid; USD 136,000 - 259,000; Full time

Benefits offered by this job

Hybrid work model

Equity

Benefits

Job summary

NVIDIA is seeking a Senior Package Layout Engineer in Santa Clara, CA to collaborate with the layout team on high-speed, high-density ASIC packages. You will optimize pinouts, routing, and power distribution while contributing to CAD library development and design feasibility studies.

The role requires 5+ years in PCB layout for graphics hardware, experience with Cadence APD, and a solid understanding of signal integrity. Hybrid remote options and competitive equity are offered.

Qualifications

• BS in Electrical Engineering or equivalent experience.
• 5+ years PCB layout experience for graphics cards, motherboards, or related tech.
• Experience with substrate layout of wire bond and flip chip packages preferred.

Responsibilities

• As part of a Layout team, implement high speed/density ASIC packages.
• Perform substrate breakout patterns for ASIC packages and optimize pinout.
• Assist with package routing, placement, stack-up, and power distribution.
• Develop CAD libraries and tools using Cadence APD.

Skills

PCB Layout

HDI designs

High-speed design

Signal integrity

Flip chip packages

Education

Bachelor's degree in Electrical Engineering

Tools

Cadence APD

Virtuoso

Calibre

Valor

Constraint Manager

Job description

NVIDIA is seeking a Senior Package Layout Engineer in Santa Clara, CA to collaborate with the layout team on high-speed, high-density ASIC packages. You will optimize pinouts, routing, and power distribution while contributing to CAD library development and design feasibility studies.

The role requires 5+ years in PCB layout for graphics hardware, experience with Cadence APD, and a solid understanding of signal integrity. Hybrid remote options and competitive equity are offered.