Senior Substrate & Package Layout Engineer — Equity & Bonus

Broadcom Inc.; San Jose (CA); On-site; USD 141,300 - 226,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(K) with company matching

Employee Stock Purchase Program

Paid holidays and sick leave

Vacation time

Job summary

A leading semiconductor company in San Jose is looking for an IC Substrate and Package Layout Engineer. The ideal candidate will design and layout advanced substrates and IC packages, collaborating with cross-functional teams to ensure high-performance results. This role requires expertise with Cadence layout tools and offers a competitive salary range of $141,300 - $226,000 along with a comprehensive benefits package, including bonuses and equity grants.

Qualifications

• 12 years of related experience with a bachelor's degree.
• 10+ years of experience with a master's degree.
• 7+ years of experience with a PhD.

Responsibilities

• Design and layout advanced substrates and IC packages.
• Develop and utilize script-based layout tools.
• Collaborate with design and verification teams.

Skills

Expertise with Cadence layout tools

Knowledge of multilayer high speed RF design

Deep understanding of package/substrate manufacturing processes

Experience with DRC and LVS checking

Collaboration with cross-functional teams

Education

Bachelor's degree in Material Science/Electrical/Computer/Mechanical Engineering

Master's degree

PhD

Tools

Calibre/Klayout

Cadence (Allegro Package Design, Innovus, Virtuoso)

Job description

A leading semiconductor company in San Jose is looking for an IC Substrate and Package Layout Engineer. The ideal candidate will design and layout advanced substrates and IC packages, collaborating with cross-functional teams to ensure high-performance results. This role requires expertise with Cadence layout tools and offers a competitive salary range of $141,300 - $226,000 along with a comprehensive benefits package, including bonuses and equity grants.