Senior IC Package & Module Integration Engineer

Apple Inc.; San Francisco (CA); On-site; USD 184,700 - 324,800; Full time

Job summary

Apple Inc. in the San Francisco Bay Area is seeking a senior IC packaging engineer to develop advanced packaging solutions for consumer products.

You will interface with design, quality, supply chain and external suppliers to push new packaging technologies from concept to production. The role requires a BS with 10+ years in IC packaging, and preferred MS/PhD in mechanical engineering, physics or materials science.

Qualifications

• BS and 10+ years of relevant industry experience.
• MS or PhD in mechanical engineering, physics, materials science or similar disciplines with 10+ years of IC packaging experience.
• Hands-on knowledge in wafer bumping and packaging assembly processes including wafer back-grind, wafer dicing and flip chip attach.
• Ability to work with suppliers and cross-functional teams to meet development and ramp schedules.

Responsibilities

• Define new package characteristics based on module and system requirements.
• Define packaging specifications and work with suppliers on design selections.
• Coordinate with packaging and cross-functional teams to meet development and ramp schedules.
• Perform POC sample builds, package/process qualification, reliability testing and yield analysis.
• Define packaging roadmap based on long-term product requirements and manage supplier R&D activities.
• Deliver packaging milestones on time and ensure integration with product timelines.

Skills

IC packaging

Wafer bumping

Quality testing

DOE design

Supplier management

Education

Bachelor's degree in engineering

MS or PhD in mechanical engineering / physics / materials science

Tools

AutoCAD

APD

Multi-physics simulation

Job description

Apple Inc. in the San Francisco Bay Area is seeking a senior IC packaging engineer to develop advanced packaging solutions for consumer products.

You will interface with design, quality, supply chain and external suppliers to push new packaging technologies from concept to production. The role requires a BS with 10+ years in IC packaging, and preferred MS/PhD in mechanical engineering, physics or materials science.