Senior IC Packaging Engineer – WLP & Wafer Tech Innovator

Apple; San Francisco (CA); On-site; USD 180,000 - 260,000; Full time

Job summary

Apple in San Francisco seeks a senior IC packaging engineer to develop Custom Silicon packaging solutions in a module/system for consumer markets. You will interface between internal product design, quality, supply chain and external suppliers to develop and deploy new packaging technologies.

The role demands a BS with 10+ years, and a preference for MS/PhD with 10+ years in IC packaging, plus hands-on Wafer Level Packaging and reliability testing.

Qualifications

• BS and 10+ years of relevant industry experience.
• Preferred MS/PhD in mechanical engineering, physics, materials science or similar with 10+ years in IC packaging.
• Hands-on experience with Wafer Level Packaging and associated processes.

Responsibilities

• Interface between internal product design, quality, supply chain and external suppliers to develop and deploy new packaging technologies.
• Lead development to high-volume manufacturing and reduce cycle times.
• Present designs and data at team and executive reviews.

Skills

IC packaging

Wafer Level Packaging

Design of Experiments

Negotiation

Communication

Education

Bachelor's degree in a related field

Master's or PhD in a relevant field

Tools

AutoCAD

APD

Job description

Apple in San Francisco seeks a senior IC packaging engineer to develop Custom Silicon packaging solutions in a module/system for consumer markets. You will interface between internal product design, quality, supply chain and external suppliers to develop and deploy new packaging technologies.

The role demands a BS with 10+ years, and a preference for MS/PhD with 10+ years in IC packaging, plus hands-on Wafer Level Packaging and reliability testing.