IC Package Integration Lead

Apple Inc.; Austin (TX); On-site; USD 130,000 - 160,000; Full time

Job summary

A leading technology company based in Austin, Texas, is seeking an IC Packaging Engineering Lead to drive innovative packaging solutions and collaborate with cross-functional teams. The role requires a BS degree and 20+ years of relevant industry experience, with strong skills in semiconductor packaging design and managerial capabilities. The ideal candidate will excel in problem-solving and communication, capable of working independently and managing teams effectively. This position offers the opportunity to work on groundbreaking technologies that influence product development.

Qualifications

• Experience in Semiconductor Packaging Design, Process & Technology Development.
• Excellent understanding of cross‑functional packaging areas.
• Knowledge of advanced packaging technologies.

Responsibilities

• Lead package co‑design efforts with multiple engineering teams.
• Drive package technology development impacting performance and cost.
• Create packaging design documentation and assessments.

Skills

Semiconductor Packaging Design

Process & Technology Development

Managerial skills

Excellent communication skills

Problem solving with strong physics

Education

BS and 20+ years of relevant industry experience

Tools

Cadence APD/Allegro

Job description

Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! We are looking for a hardworking, and passionate IC Packaging Engineering Lead to join our team.

Description

• Work with cross‑functional teams and lead package integration and architecture efforts.
• Work with 3rd party and OSAT to bring packaging solution from concept to HVM Drive industry with advanced package solutions and specs.
• Work to bring innovative packaging solutions from concept to mass production, including package, module, and technology development.
• People managerial skills highly desirable.
• Travel – 5‑10%

Responsibilities

• Lead package co‑design efforts with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical, thermal, reliability and fit requirements.
• Drive package technology development which has broad impact (new technology, structure development, enhanced performance, lower cost)
• Co‑work with assembly partners on new packages from development, NPI, Qualification to high volume production.
• Create package design documentation, design rules, technical risk assessment, package checklist for Silicon TO, Development and release to production teams.

Minimum Qualifications

• BS and 20+ years of relevant industry experience.

Preferred Qualifications

• We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development, Managerial skills highly desired.
• Good understanding of cross‑functional packaging areas: Si floor plan, package layout and architecture, enabling process technologies, thermal, mechanical, SI/PI, material, component & system level reliability, testing, and FA.
• Knowledgeable in advanced packaging technologies: Knowledge and insight to deliver high density / high performance interconnects in various form factor, thermo‑mechanical, reliability, and cost constraints.
• Background and Knowledge of Cellular/Connectivity/PMU packaging highly desirable.
• Excellent problem solving with strong physics and fundamentals.
• Excellent communication skills that enable the candidate to work well with internal cross functional teams and overseas suppliers.
• Multi‑functional coverage on package layout (Cadence APD/Allegro), critical signal integrity / power integrity, thermal, design rules, BOM, design for manufacturing, reliability, and cost.
• Ability to work independently and take on projects with minimum supervision.
• Ability to lead and manage teams.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.

Apple accepts applications to this posting on an ongoing basis.