Senior IC Packaging Engineer — Innovate for High‑Volume Modules

Apple Inc.

San Francisco (CA)

On-site

USD 185,000 - 325,000

Full time

10 days ago

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Job summary

Apple Inc. in San Francisco, CA is seeking a senior IC packaging engineer to lead custom silicon packaging solutions for consumer markets.

You will interface with product design, quality, supply chain and external suppliers to deploy new packaging technologies in high-volume manufacturing. The role requires extensive hands-on experience in IC packaging, wafer bumping, and reliability testing, with strong negotiation and leadership skills to drive cross-functional collaboration and schedule

Qualifications

BS with 10+ years in IC packaging or related field.
MS/PhD preferred with deep experience in Wafer Level Packaging and BEOL.
Familiarity with wafer bumping, die attach, encapsulation, and reliability testing.

Responsibilities

Define new package characteristics based on module and system requirements.
Define packaging specifications for cost and footprint targets.
Collaborate with external suppliers on design, materials, equipment, and process flow.
Perform proof of concept, POR establishment, qualification, reliability tests, and yield analysis.
Coordinate with cross-functional teams to meet development and ramp schedules.
Deliver packaging milestones on time and drive packaging roadmap.
Manage suppliers' R&D activities.