Lead IC Packaging & Integration Engineer

Apple Inc.; San Francisco (CA); On-site; USD 185,000 - 325,000; Full time

Benefits offered by this job

Medical and dental coverage

Employee stock programs

Relocation assistance

Job summary

Apple Inc. in the San Francisco Bay Area seeks an IC Packaging Engineering Lead to drive package integration and architecture with cross-functional Silicon, Packaging, and Systems teams.

You will shepherd packaging concepts from development through high-volume manufacturing, collaborating with OSATs and assembly partners to deliver cost‑effective, high-performance solutions. The role requires a strong technical foundation in semiconductor packaging, a track record of delivering complex packages,

Qualifications

• BS and 10+ years of relevant industry experience.
• MS/PhD and 6+ years of experience in relevant industry.
• Experience in Semiconductor Packaging Design, Process & Technology Development.
• Knowledgeable in advanced packaging technologies and SiP packaging desirable.

Responsibilities

• Lead package co-design with Silicon, Packaging, and Systems teams to meet electrical, mechanical, thermal, reliability and fit requirements.
• Drive package technology development with broad impact (new technology, structure development, enhanced performance, lower cost).
• Co-work with assembly partners on new packages from development to high volume production.
• Create package design documentation, design rules, risk assessments, and release checklists.

Skills

Package co-design

Cross-functional teams

Problem solving

Physics fundamentals

Strong communication

Independent working

Packagng co-design

Education

BS in Engineering

MS/PhD

Tools

Cadence Allegro

Job description

Apple Inc. in the San Francisco Bay Area seeks an IC Packaging Engineering Lead to drive package integration and architecture with cross-functional Silicon, Packaging, and Systems teams.

You will shepherd packaging concepts from development through high-volume manufacturing, collaborating with OSATs and assembly partners to deliver cost‑effective, high-performance solutions. The role requires a strong technical foundation in semiconductor packaging, a track record of delivering complex packages,