Senior IC Packaging Architect & Integration Lead

Apple Inc.; San Francisco (CA); On-site; USD 184,700 - 324,800; Full time

Benefits offered by this job

Employee stock programs

Medical and dental coverage

Relocation assistance

Tuition reimbursement

Job summary

Apple Inc. in San Francisco Bay Area, CA, United States is seeking an IC Packaging Engineering Lead to drive advanced packaging architectures and mass production strategies.

The role emphasizes cross-functional leadership across Silicon, Packaging, and Systems teams, with close collaboration with OSATs and assembly partners. The candidate will manage packaging tech development, ensure reliability and cost targets, and guide documentation and risk assessments for successful transitions from

Qualifications

• BS and 10+ years of relevant industry experience.
• Experience in semiconductor packaging design and technology development.
• Excellent communication and leadership skills.

Responsibilities

• Lead package co-design with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical, thermal, reliability and fit requirements.
• Drive package technology development which has broad impact (new technology, structure development, enhanced performance, lower cost).
• Co-work with assembly partners on new packages from development, NPI, Qualification to high volume production.
• Create package design documentation, design rules, technical risk assessment, package checklist for Silicon TO, Development and release to production teams.

Skills

Semiconductor packaging

Package design

Cross-functional leadership

Thermal analysis

Education

BS degree in engineering

Tools

Cadence APD/Allegro

Job description

Apple Inc. in San Francisco Bay Area, CA, United States is seeking an IC Packaging Engineering Lead to drive advanced packaging architectures and mass production strategies.

The role emphasizes cross-functional leadership across Silicon, Packaging, and Systems teams, with close collaboration with OSATs and assembly partners. The candidate will manage packaging tech development, ensure reliability and cost targets, and guide documentation and risk assessments for successful transitions from