Senior IC Package Design Engineer, SiP/SoC AI-Driven

Apple Inc.; Austin (TX); On-site; USD 175,000 - 309,000; Full time

Job summary

Apple Inc. seeks a Package Design Engineer in Austin to drive the physical design of advanced semiconductor packages across SoC, memory, RF, and cellular tech. You will shape architecture, scalability, and efficiency while advancing design methodologies with automation and AI.

You will lead package architecture, optimize configurations, and own Package/SiP/module physical design from concept to tape-out, collaborating with cross-functional teams and applying AI to improve design quality and pace.

Qualifications

• BS in electrical engineering or related field with 10+ years in package design.

Responsibilities

• Lead advanced package architecture and physical design from concept through tape-out.
• Perform parasitic extraction and S-parameter modeling to meet SI/PI targets.
• Collaborate with cross-functional teams on chip floorplan, package configuration, and electrical performance.
• Drive design automation by evaluating CAD tools and creating automated design/verification flows.

Skills

High-speed design

SI/PI analysis

Automation scripting

Education

Bachelor's degree in Electrical Engineering or related field

Tools

Cadence Allegro

Mentor Xpedition

Calibre

CAM350

HFSS

PowerSI

Job description

Apple Inc. seeks a Package Design Engineer in Austin to drive the physical design of advanced semiconductor packages across SoC, memory, RF, and cellular tech. You will shape architecture, scalability, and efficiency while advancing design methodologies with automation and AI.

You will lead package architecture, optimize configurations, and own Package/SiP/module physical design from concept to tape-out, collaborating with cross-functional teams and applying AI to improve design quality and pace.