IC Packaging Engineer - 2.5D/3D SoC Lead

Apple Inc.; Santa Clara (CA); On-site; USD 143,100 - 264,200; Full time

Job summary

Apple Inc. in Santa Clara, CA is seeking an IC Packaging Engineer to lead packaging technology development for SoC projects, including 2.5D/3D packaging, and to drive integration across multi-functional teams and external partners.

You will work closely with foundry and OSAT partners to move packaging concepts from design to high-volume manufacturing, while developing new materials and packaging specs for advanced products.

Qualifications

• BS and 3+ years of relevant industry experience.
• Experience in semiconductor packaging field preferred.
• Knowledge of materials characterization and analysis.
• Understanding of memory packaging developments.
• Ability to collaborate with multi-functional teams and overseas suppliers.

Responsibilities

• Lead packaging technology development including advanced 2.5D/3D packaging.
• Lead SoC package integration efforts with cross-functional teams.
• Drive package architecture and integration innovation.
• Collaborate with foundry and OSAT to move packaging from concept to high-volume manufacturing.
• Develop new materials and packaging specifications.
• Travel up to 5% internationally.

Skills

Wafer Level Packaging

2.5D Packaging

3D Packaging

Package Integration

APD

Virtuoso

Semiconductor Packaging

Education

BS degree in engineering

Tools

APD

Virtuoso

Job description

Apple Inc. in Santa Clara, CA is seeking an IC Packaging Engineer to lead packaging technology development for SoC projects, including 2.5D/3D packaging, and to drive integration across multi-functional teams and external partners.

You will work closely with foundry and OSAT partners to move packaging concepts from design to high-volume manufacturing, while developing new materials and packaging specs for advanced products.