Senior IC Packaging Engineer: RF/mmWave SI/PI Lead

Blue Origin; Central (TX); On-site; USD 230,398 - 322,556; Full time

Benefits offered by this job

Relocation provided

Travel up to 10%

Job summary

Blue Origin’s Silicon Systems group seeks a Senior IC Packaging: Signal and Power Integrity Engineer to own SI/PI for RF/mixed-signal and mmWave IC packaging. You will lead SI work and collaborate with RFIC, mmWave, ASIC, and SoC teams to enable high-speed packaging deliveries.

The role is onsite in San Diego, Bay Area, or Austin, with up to 10% travel and relocation support. This position emphasizes technical leadership and rigorous signal integrity practices.

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• 7+ years of industry experience or PhD-equivalent research.
• Experience delivering IC packaging in production or tangible-delivery environment.
• Expertise with 2.5D and 3D EM simulators such as HFSS, EMX, or Momentum.
• Experience with RF modeling, RF impedance, and SI/PI for high-speed routing.
• U.S. citizen or national, U.S. permanent resident, or eligible refugee/asylum status.

Responsibilities

• Own SI/PI for RF/Mixed-Signal and mmWave IC packaging designs.
• Perform SI analysis and HFSS simulations for high-speed signals across package interfaces.
• Design and analyze PDNs using HFSS to meet PI targets.
• Model RF/mmWave packaging with HFSS tools and procedures.
• Collaborate with RFIC, mmWave, ASIC, Package Layout, and SoC teams on package requirements.
• Lead the SI/PI portion of package delivery as technical lead.
• Create documentation and support design reviews for packaging deliverables.

Skills

Signal integrity

Power integrity

HFSS

EM simulators

RF packaging

Team collaboration

Technical leadership

Education

Bachelor's degree in Electrical Engineering

Advanced degree (MS/PhD)

Tools

HFSS

EMX

Momentum

Cadence Allegro

Job description

Blue Origin’s Silicon Systems group seeks a Senior IC Packaging: Signal and Power Integrity Engineer to own SI/PI for RF/mixed-signal and mmWave IC packaging. You will lead SI work and collaborate with RFIC, mmWave, ASIC, and SoC teams to enable high-speed packaging deliveries.

The role is onsite in San Diego, Bay Area, or Austin, with up to 10% travel and relocation support. This position emphasizes technical leadership and rigorous signal integrity practices.