Senior IC Packaging Engineer: Signal & Power Integrity

Blue Origin LLC; California (MO); Hybrid; USD 230,000 - 323,000; Full time

Benefits offered by this job

Medical, dental, vision insurance

Paid parenal leave

Disability insurance

401(k) with company match

Education support program

Stock options

Paid time off

Job summary

Blue Origin is hiring a Senior IC Packaging: Signal and Power Integrity Engineer to own SI/PI for RFIC and mmWave packaging. You will work with RFIC, mmWave, ASIC, and SoC teams on packaging requirements and deliverables.

This is an individual contributor role with potential technical leadership, onsite in CA or TX, supporting HFSS-based simulations and power-network designs for high-speed packaging tasks.

Qualifications

• Bachelor's degree in Electrical Engineering or related field such as Computer Engineering.
• 7+ years of industry experience, or the combination of industry experience and equivalent research from a PhD program.
• Demonstrated experience delivering integrated circuit packaging in a production or tangible-delivery environment.
• Expertise with 2.5D and 3D electromagnetic simulators such as HFSS, EMX, or Momentum.
• Experience with RF modeling, RF impedance, and signal and power integrity for high-speed routing.
• Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Responsibilities

• Own signal and power integrity for RF/Mixed-Signal and mmWave IC packaging designs.
• Perform signal integrity analysis and HFSS simulation for high-speed signals across package interfaces.
• Design and analyze power delivery networks using HFSS to meet power integrity targets.
• Model and characterize RF and mmWave packaging with HFSS simulation tools and procedures.
• Collaborate with RFIC, mmWave, ASIC, Package Layout, and SoC architecture teams on package requirements.
• Lead the signal and power integrity portion of package delivery as a technical lead.
• Create documentation and specifications and support design reviews for packaging deliverables.

Skills

Signal integrity

Power integrity

HFSS simulation

RF/mixed-signal packaging

2.5D/3D EM simulators

RF modeling

Cadence Allegro

Education

Bachelor's degree in Electrical Engineering

Advanced degree preferred (MS/PhD)

Tools

HFSS

EMX

Momentum

Cadence Allegro

Job description

Blue Origin is hiring a Senior IC Packaging: Signal and Power Integrity Engineer to own SI/PI for RFIC and mmWave packaging. You will work with RFIC, mmWave, ASIC, and SoC teams on packaging requirements and deliverables.

This is an individual contributor role with potential technical leadership, onsite in CA or TX, supporting HFSS-based simulations and power-network designs for high-speed packaging tasks.