RF Packaging Design Engineer - mm-Wave ICs & AI-Driven

Amazon Kuiper Manufacturing Enterprises LLC; San Diego (CA); Vor Ort; USD 154.000 - 215.000; Vollzeit

Zusammenfassung

Amazon Leo is seeking an experienced IC Packaging Design Engineer in San Diego to lead power-optimized package solutions for mm-wave beamforming ICs and front-end modules. You will collaborate with cross-functional teams, suppliers, and RF designers to define floorplans, materials, and thermal strategies.

The role emphasizes AI-driven packaging workflows, advanced RF knowledge, and proven production-ready packaging expertise in high-performance chips.

Qualifikationen

• Bachelor's degree in Electrical Engineering or related field.
• 5+ years RF design experience, preferably in an advanced node.
• Proven track record delivering products to volume production.
• Experience with RF communication systems.

Aufgaben

• Collaborate with digital design and RF chip designers to define floorplans, bump maps, and ball maps for beamforming ICs.
• Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design.
• Analyze cost/performance trade-offs and complete layout of packages like FCBGA, FCCSP, WLCSP, QFN.
• Set up and run 3D electromagnetic simulations of package+PCB to verify designs.
• Perform signal integrity checks and model packages to identify crosstalk and coupling.
• Assist the thermal team in defining and running thermal simulations of packages and PCBs.
• Collaborate with Antenna and EE teams to design/test PCBs for packages.
• Advise on qualification of packages: HAST, HTOL, board-level reliability, etc.
• Define and implement AI-driven workflows for packaging design to accelerate iterations.

Kenntnisse

RF design

Package design

S-parameters

Impedance matching

Power integrity

High-speed interfaces

Serdes

Thermal analysis

PCB layout

Ausbildung

Bachelor's degree in Electrical Engineering

Master's degree in Electrical/Communications Engineering

Tools

HFSS

Momentum

Jobbeschreibung

Amazon Leo is seeking an experienced IC Packaging Design Engineer in San Diego to lead power-optimized package solutions for mm-wave beamforming ICs and front-end modules. You will collaborate with cross-functional teams, suppliers, and RF designers to define floorplans, materials, and thermal strategies.

The role emphasizes AI-driven packaging workflows, advanced RF knowledge, and proven production-ready packaging expertise in high-performance chips.