Senior RF/mmWave IC Packaging & SI Lead

Blue Origin

Cupertino (CA)

On-site

USD 230,000 - 323,000

Full time

14 days+
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Benefits offered by this job

Relocation provided
Travel up to 10%

Job summary

Blue Origin is seeking a Senior IC Packaging: Signal and Power Integrity Engineer to own signal and power integrity for RFIC and mmWave packaging. You will perform SI analysis, HFSS simulations, and help deliver packaging with strong collaboration across RFIC, mmWave, ASIC, and SoC teams.

This onsite role requires relocation and may involve up to 10% travel. A U.S. citizen or eligible to work in the U.S. is preferred; interviews will include a technical assessment.

Qualifications

  • Bachelor's degree in Electrical Engineering or related field.
  • 7+ years of industry experience or equivalent research.
  • Experience delivering IC packaging in production or delivery environment.
  • Experience with 2.5D/3D electromagnetic simulators (HFSS/EMX/Momentum).
  • Experience with RF modeling and high-speed routing SI/PI.

Responsibilities

  • Own signal and power integrity for RF/Mixed-Signal and mmWave IC packaging designs.
  • Perform SI analysis and HFSS simulation for high-speed signals across package interfaces.
  • Design and analyze power delivery networks to meet PI targets.
  • Model and characterize RF and mmWave packaging with HFSS tools.
  • Collaborate with RFIC, mmWave, ASIC, Package Layout, and SoC teams.
  • Lead SI/PI portion of package delivery as a technical lead.
  • Create documentation and support design reviews for packaging deliverables.

Skills

Signal integrity
Power integrity
HFSS simulation
RF packaging
2.5D/3D EM simulators
RF modeling

Education

Bachelor's degree in Electrical Engineering
Advanced degree (MS/PhD) preferred

Tools

HFSS
EMX
Momentum
Cadence Allegro

Job description

Blue Origin is seeking a Senior IC Packaging: Signal and Power Integrity Engineer to own signal and power integrity for RFIC and mmWave packaging. You will perform SI analysis, HFSS simulations, and help deliver packaging with strong collaboration across RFIC, mmWave, ASIC, and SoC teams.

This onsite role requires relocation and may involve up to 10% travel. A U.S. citizen or eligible to work in the U.S. is preferred; interviews will include a technical assessment.

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