Senior IC Packaging Engineer - 2.5D/3D SoC

Apple

San Francisco (CA)

On-site

USD 180,000 - 240,000

Full time

14 days+

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Job summary

Apple is seeking an IC Packaging Engineer to drive integration across SoC and advanced 2.5D/3D packaging projects, from trade-off studies through delivery. You will lead DOE activities and coordinate with foundry and OSAT partners to enable MP-ready packaging solutions.

The role requires deep packaging expertise and strong cross-functional collaboration across design, test, reliability, and product teams. You will manage complex technical deliverables end-to-end and act as a technical anchor

Qualifications

MS or PhD in semiconductor packaging, materials, thermal, mechanical, or electrical modeling.
Track record taking packages from concept to high-volume manufacturing (HVM).
Expertise in Wafer Level Packaging, 2.5D and 3D packaging.
Strong materials characterization knowledge.
Broad understanding of packaging technologies and FA techniques.
Experience with package design software (APD, Virtuoso or equivalent).
Experience in memory packaging.
Excellent cross-functional collaboration and supplier partnerships.
Ability to lead multi-team projects with minimal supervision.
Strong fundamentals in engineering physics and program management.

Responsibilities

Drive package integration across SoC and advanced 2.5D/3D projects from architecture trade-offs to delivery.
Manage process development and enable MP-ready packaging solutions with foundry and OSAT partners.
Serve as technical anchor across design, test, reliability, and product teams.
Lead DOEs and build execution; orchestrate complex multi-team programs.