Principal Packaging Design Engineer – Advanced Semiconductors

Renesas Electronics Corp.; San Jose (CA); Hybrid; USD 200,000 - 240,000; Full time

Job summary

Renesas Electronics Corp. is seeking a Principal Package Design Engineer to lead development of next-generation packaging solutions for high-performance semiconductors.

The role focuses on advanced package architecture, assembly processes, thermal reliability, and cross-functional collaboration across design, product engineering, and manufacturing. The ideal candidate has deep packaging expertise, a track record of moving complex products from concept through qualification to high-volume

Qualifications

• MSc or PhD in a relevant field.
• 5+ years in advanced semiconductor packaging or system integration.
• Strong hands-on knowledge of packaging technologies and integration for AI infrastructure.
• Experience with OSATs, substrate vendors, and supply chains.
• Proven ability to troubleshoot packaging failures and lead projects.

Responsibilities

• Lead design, development, and qualification of advanced packaging solutions (Flip-chip, WLP, 2.5/3D, SiP, BGA).
• Define package architecture based on electrical, thermal, mechanical, and cost requirements with advanced simulations.
• Drive OSAT selection and development for NPI and collaboration with cross-functional teams.
• Oversee layout reviews, stack-up definition, material selection, and interconnect strategy.
• Perform and guide simulations for signal/thermal/mechanical aspects and DFM.

Skills

Advanced packaging

Thermal analysis

Mechanical simulation

DFM/DFX

Technical leadership

Education

MSc or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field

Tools

Cadence Allegro Package Designer

SolidWorks

ANSYS

COMSOL

JMP / Minitab

Job description

Renesas Electronics Corp. is seeking a Principal Package Design Engineer to lead development of next-generation packaging solutions for high-performance semiconductors.

The role focuses on advanced package architecture, assembly processes, thermal reliability, and cross-functional collaboration across design, product engineering, and manufacturing. The ideal candidate has deep packaging expertise, a track record of moving complex products from concept through qualification to high-volume