Principal Advanced Packaging Engineer (Hybrid)

Renesas Electronics Corp.; TX, US; Hybrid; USD 140,000 - 210,000; Full time

Job summary

Renesas Electronics Corp. is seeking a Principal Package Design Engineer to lead development and integration of next-generation packaging solutions for high-performance semiconductors.

You will drive advanced packaging architectures, assembly processes, and reliability testing across cross-functional teams to deliver scalable product solutions. The role requires deep expertise in 2.5D/3D packaging, SiP, and OSAT collaboration, with a proven track record from concept through qualification to

Qualifications

• MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field.
• 5+ years of experience in advanced semiconductor packaging or advanced electronics packaging and system integration.
• Strong hands‑on knowledge of advanced packaging technologies, materials, assembly processes, and application system integration as they apply to AI infrastructure and data center power management.
• Deep understanding of thermal, mechanical, and electrical interactions in package design and extensive, hands‑on model setup, simulations, and analysis. Strong background in CAD and simulation tools.

Responsibilities

• Lead the design, development, and qualification of advanced semiconductor packaging solutions, including flip-chip, WLP/FOWLP, panel-level packaging, 2.5D/3D, SiP, BGA/CSP, and heterogeneous bonding.
• Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements with hands‑on, deep simulation expertise.
• Drive package technology and OSAT selection and development for new product introductions (NPI).
• Work with IC design, product definers, substrate, board, thermal, reliability, applications, and manufacturing teams to ensure package compatibility and performance.
• Oversee package layout reviews, stack-up definition, material selection, and interconnect strategy.
• Perform and guide simulations related to signal integrity, thermal performance, mechanical stress, and DFM.
• Develop assembly flows and qualification activities, including DOE planning and reliability testing.
• Resolve packaging-related issues and drive yield improvements with suppliers and partners.
• Create and maintain package specs, design rules, and technical reports; mentor junior engineers.

Skills

Advanced packaging concept engineering

Thermal & mechanical simulations

Cross-functional leadership

DFM/DFX design

Education

MSc or PhD in Electrical Engineering or related field

Tools

Cadence Allegro Package Designer

SolidWorks

ANSYS

COMSOL

JMP / Minitab

Job description

Renesas Electronics Corp. is seeking a Principal Package Design Engineer to lead development and integration of next-generation packaging solutions for high-performance semiconductors.

You will drive advanced packaging architectures, assembly processes, and reliability testing across cross-functional teams to deliver scalable product solutions. The role requires deep expertise in 2.5D/3D packaging, SiP, and OSAT collaboration, with a proven track record from concept through qualification to