Senior Director, Chiplet Packaging & FCBGA Innovation

Semiengineering; Tempe (AZ); Hybrid; USD 180,000 - 250,000; Full time

Job summary

Amkor in Tempe, AZ is seeking a Sr. Director, Chiplets/FCBGA to lead strategy, development, and execution of advanced chiplet-based module technologies for AI, computing, networking, and PCs.

You will interface with Tier 1 customers and Amkor’s R&D center in Korea to drive roadmaps and successful commercialization. You’ll lead cross-functional teams through concept to production ramp while guiding technology directions, performance targets, and reliability goals.

Qualifications

• Bachelor’s degree in Engineering; Master’s preferred.
• Experience leading advanced packaging or product development programs within a global organization.
• Strong understanding of IC package design environments and trade-offs for FCBGA and heterogeneous module-based packaging.

Responsibilities

• Lead advanced IC package development initiatives with customers and development teams.
• Drive strategic engagement with Tier 1 customers on roadmaps and reviews.
• Champion innovation in package architectures, materials, and thermal management.
• Lead cross-functional teams including design, materials, simulation, reliability, and process development.
• Guide product development from concept through qualification, tech transfer, and ramp.
• Identify technical and business opportunities to expand Amkor’s position in AI, HPC, and networking packaging.
• Monitor industry trends to influence product strategy and priorities.
• Manage program objectives, schedules, risks, and customer expectations.

Skills

Communication

Leadership

Global collaboration

Education

Bachelor's degree in Engineering

Master's degree

Job description

Amkor in Tempe, AZ is seeking a Sr. Director, Chiplets/FCBGA to lead strategy, development, and execution of advanced chiplet-based module technologies for AI, computing, networking, and PCs.

You will interface with Tier 1 customers and Amkor’s R&D center in Korea to drive roadmaps and successful commercialization. You’ll lead cross-functional teams through concept to production ramp while guiding technology directions, performance targets, and reliability goals.