Director, Advanced Packaging & 2.5D/Wafer Solutions

MIcro-Precision Technologies; Tempe (AZ); Hybrid; USD 180,000 - 260,000; Full time

Job summary

Amkor in Tempe, AZ seeks a senior Director of Advanced Packaging and Wafer Services to lead strategic customer engagements and drive commercialization of next-generation wafer-based IC packages, including 2.5D, chiplet architectures, and related technologies.

The role interfaces with Tier 1 customers, Amkor's global R&D centers, and cross-functional teams to steer roadmaps, program execution, and production ramp, with 10–20% travel. Hybrid work is offered in Tempe, AZ.

Qualifications

• Bachelor's degree in Engineering required; Master's or PhD preferred.
• 10+ years in semiconductor package development, wafer-level packaging, IC packaging, or wafer process technology.

Responsibilities

• Lead strategic customer engagements with Tier 1 customers and align requirements with the technology roadmap.
• Coordinate development activities with global R&D teams to ensure timely execution of advanced package programs.
• Serve as senior interface for customer meetings, reviews, and technical discussions during development and qualification phases.
• Lead cross-functional teams across R&D, design, fabrication, and operations to execute complex packaging programs.
• Own customer product management through concept, feasibility, development, qualification, and initial production ramp.
• Guide tradeoff decisions on package architecture, wafer integration, materials, and yield risk.
• Engage ecosystem partners and suppliers to influence technology choices and roadmaps.

Skills

Strategic leadership

Customer engagement

Cross-functional collaboration

Technical communication

Travel readiness

Program leadership

Education

Bachelor's degree in Engineering

Master's degree or Ph.D.

Job description

Amkor in Tempe, AZ seeks a senior Director of Advanced Packaging and Wafer Services to lead strategic customer engagements and drive commercialization of next-generation wafer-based IC packages, including 2.5D, chiplet architectures, and related technologies.

The role interfaces with Tier 1 customers, Amkor's global R&D centers, and cross-functional teams to steer roadmaps, program execution, and production ramp, with 10–20% travel. Hybrid work is offered in Tempe, AZ.