Sr. Director, Chiplets/FCBGA BU

Amkor Technology, Inc.; Tempe (AZ); Hybrid; USD 180,000 - 240,000; Full time

Job summary

Amkor Technology, Inc. in Tempe, AZ seeks a Senior Director, Chiplets/FCBGA Business Unit to lead a team of BU engineers responsible for program management of advanced packaging solutions, including chiplet-based IC packages, High Density Fan-Out (HDFO), and other advanced package technologies supporting computing, networking, and mobile markets.

This role serves as the primary business unit leader for strategic Tier 1 customer programs, partnering with Amkor's R&D organization in South

Qualifications

• Bachelor's degree in Engineering or related technical discipline.
• Minimum 12 years of semiconductor packaging experience.
• Experience leading complex customer programs and cross-functional teams.

Responsibilities

• Lead a team of BU engineers from R&D to high-volume manufacturing.
• Represent the BU for Tier-1 customer engagements.
• Coordinate package development with customers and R&D.
• Lead reviews, technical discussions, and status meetings.
• Oversee product lifecycle management and capacity planning.

Skills

Leadership

Cross-functional collaboration

Program management

Executive communication

Education

Bachelor's degree in Engineering or related field

Job description

Requisition ID29094-Posted10/02/2026-Product Management-Regular Exempt Full-Time Employee

Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com .

Position Summary:

Amkor is seeking a Senior Director, Chiplets/FCBGA Business Unit to lead a team of Business Unit (BU) engineers responsible for the program management of advanced semiconductor packaging solutions, including chiplet-based IC packages, High Density Fan-Out (HDFO), and other advanced package technologies supporting the computing, networking, and mobile markets.

This role serves as the primary business unit leader for strategic Tier 1 customer programs, partnering closely with Amkor's advanced R&D organization in South Korea and high-volume manufacturing (HVM) sites worldwide. The Senior Director provides leadership across product development, qualification, production ramp, and lifecycle management while driving business planning activities, including forecasting, pricing strategy, cost modeling, capacity planning, and capital expenditure analysis aligned with customer roadmaps and business objectives.

Essential Duties and Responsibilities:

• Lead and develop a team of Business Unit engineers responsible for customer programs from early-stage R&D through high-volume manufacturing and ongoing production support.
• Serve as the primary business unit representative for strategic Tier 1 customer engagements, fostering strong partnerships and ensuring alignment on technical and project development objectives.
• Drive and coordinate package development activities with customers and Amkor's R&D organizations to support successful product development and qualification.
• Lead customer reviews, technical discussions, project status meetings, and follow-up actions throughout the development lifecycle.
• Direct cross-functional teams consisting of R&D,Production, Design, Characterization and Simulation teams to ensure program execution aligns with customer expectations and business goals.
• Oversee product lifecycle management activities, including development, qualification, production ramp, and sustaining support.
• Develop and maintain business forecasts, capacity plans, pricing models, and revenue projections to support customer requirements and business objectives.
• Perform cost modeling, profitability analysis, and CAPEX evaluations to support investment decisions and long-term customer roadmaps.
• Identify and mitigate technical, operational, and supply chain risks that may impact program execution or customer success.
• Drive continuous improvement initiatives to enhance operational efficiency, execution quality, and customer satisfaction.

Required Qualifications:

• Bachelor's degree in Engineering, Materials Science, Mechanical Engineering, or a related technical discipline.
• Minimum of 12 years of semiconductor packaging experience, including direct experience in wafer-level and IC packaging.
• Demonstrated experience leading complex customer programs and cross-functional teams in a semiconductor or advanced packaging environment.
• Strong understanding of IC package design principles and the trade-offs associated with package architecture, process development, and manufacturability for FCBGA technologies.
• Knowledge of semiconductor packaging materials, assembly processes, reliability requirements, failure mechanisms, and product qualification methodologies.
• Experience with forecasting, capacity planning, capital expenditure planning, pricing strategies, and business case development.
• Strong program and project management skills with the ability to manage multiple priorities and stakeholders.
• Excellent written, verbal, presentation, and executive communication skills.
• Demonstrated ability to collaborate effectively across global teams and cultures.
• Ability to travel domestically and internationally up to 10-20%.

Preferred Qualifications:

• Master's degree in Engineering, Materials Science, Business Administration, or a related field is a plus.
• Expertise in High Density Fan-Out (HDFO) or bridge-like chiplet module constructions, constraints and tradeoffs.
• Experience supporting Tier 1 customers in the computing, networking, mobile, artificial intelligence, or high-performance computing markets.
• Familiarity with Design of Experiments (DOE), Statistical Process Control (SPC), and advanced manufacturing process optimization techniques.
• Experience with semiconductor package cost modeling, technology roadmaps, and strategic business planning.
• Working knowledge of advanced package characterization, simulation, and reliability analysis methodologies.

Location:

Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.