Senior Director, Chiplet Packaging & FCBGA Innovation

Amkor Technology; Tempe (AZ); On-site; USD 220,000 - 270,000; Full time

Job summary

Amkor Technology, Inc. in Tempe, AZ seeks a Sr. Director, Chiplets/FCBGA to lead strategy, development, and execution of advanced chiplet-based module technologies including HDFO and other IC package solutions for AI, HPC, and networking markets.

The role interfaces with Tier 1 customers and Amkor's R&D center in South Korea, driving roadmaps, customer engagement, and successful commercialization of next‑gen packaging solutions. 20% domestic and 20% international travel required.

Qualifications

• Bachelor's degree in Engineering (Mechanical Engineering or Materials Science) required; Master's preferred.
• 12+ years of experience in semiconductor packaging development.
• Experience leading advanced packaging programs within a global organization.
• Strong understanding of IC package design environments for FCBGA and heterogeneous module-based packaging.
• Experience with offshore development teams is highly desired.
• Excellent written, verbal, and customer-facing communication skills.
• Willingness to travel 20% domestic and 20% international.

Responsibilities

• Lead advanced IC package development initiatives with customers and Amkor's teams in Korea, aligning solutions with requirements.
• Drive strategic engagement with Tier 1 customers, including technology roadmap discussions and reviews.
• Champion innovation in package architectures, materials, thermal management, warpage control, and heterogeneous integration.
• Lead cross-functional teams across design, materials, simulation, reliability, and process development.
• Guide development from concept through qualification, transfer, and production ramp.
• Identify opportunities to expand Amkor's packaging solutions for AI, HPC, and networks.
• Monitor industry trends to influence product strategy and priorities.
• Manage program objectives, schedules, risks, and customer expectations.

Skills

Semiconductor packaging

Project leadership

Global collaboration

Customer engagement

IC packaging knowledge

Education

Bachelor's degree in Engineering

Master's degree preferred

Job description

Amkor Technology, Inc. in Tempe, AZ seeks a Sr. Director, Chiplets/FCBGA to lead strategy, development, and execution of advanced chiplet-based module technologies including HDFO and other IC package solutions for AI, HPC, and networking markets.

The role interfaces with Tier 1 customers and Amkor's R&D center in South Korea, driving roadmaps, customer engagement, and successful commercialization of next‑gen packaging solutions. 20% domestic and 20% international travel required.