Director, fcCSP Packaging & NPI Strategy

Amkor Technology, Inc.; Tempe (AZ); Hybrid; USD 150,000 - 200,000; Full time

Job summary

Amkor Technology, Inc. in Tempe, AZ, is seeking a Director-level fcCSP Advanced Packaging Product Engineer to lead product development and strategy for flip-chip technologies.

The role emphasizes NPI, pricing controls, supplier development, and customer negotiations, requiring a Bachelor's in engineering and 10+ years in semiconductor packaging. Hybrid work in Tempe supports collaboration with global teams and customers.

Qualifications

• Bachelor's degree in engineering required.
• Minimum 10 years in the semiconductor industry.
• Experience in IC package development / fcCSP technologies.
• Strong PM, organizational skills and cross-functional coordination.
• Proficiency in Excel, PowerPoint, and MS Office.
• Excellent communication and presentation skills.

Responsibilities

• Lead product development and business strategy for fcCSP packages.
• Manage pricing, cost controls, and RFQ processes with customers.
• Collaborate with engineering, manufacturing, and supply chain teams.
• Develop supplier relationships and end-to-end supply chains.
• Coordinate NPI from inception to production qualification.
• Negotiate with customers and manage project portfolios.

Skills

Project management

MS Excel

PowerPoint

Strong communication

Cross-functional collaboration

Self-driven

Education

Bachelor's degree in Engineering

Tools

MS Office

Job description

Amkor Technology, Inc. in Tempe, AZ, is seeking a Director-level fcCSP Advanced Packaging Product Engineer to lead product development and strategy for flip-chip technologies.

The role emphasizes NPI, pricing controls, supplier development, and customer negotiations, requiring a Bachelor's in engineering and 10+ years in semiconductor packaging. Hybrid work in Tempe supports collaboration with global teams and customers.