VP of Advanced IC Packaging & Innovation Lead

Amkor Technology, Inc.; Peoria (AZ); On-site; USD 230,000 - 330,000; Full time

Job summary

Amkor Technology, Inc. in Tempe/Peoria is seeking a strategic VP to lead Advanced Packaging Technology. You will shape roadmaps, engage Tier 1 customers, and drive development across global teams, including Korea R&D, to deliver state-of-the-art IC packaging solutions.

The role requires 15+ years in packaging, strong leadership, and extensive collaboration across engineering, operations, and sales, with travel up to 20% internationally. Based in AZ with global responsibilities.

Qualifications

• Bachelor’s degree in Engineering is required; Master’s degree preferred.
• 15+ years in semiconductor packaging development required, or 13+ years with a Master’s.
• Ability to work independently in a global organization.
• Deep knowledge of IC packaging materials, failure modes, and reliability qualification.
• Experience translating customer requirements into packaging development strategies.
• Willingness to travel 20% domestic and 20% international.

Responsibilities

• Lead and coordinate advanced packaging development activities with customers and Amkor teams.
• Drive strategic engagement with Tier 1 customers and oversee development programs.
• Collaborate across engineering, operations, manufacturing, sales, and R&D.
• Serve as liaison between the Chiplets/FCBGA BU, ATA operations, and global R&D teams.
• Maintain ownership of product strategy through qualification and ramp.
• Lead cross-functional decision-making and resource alignment.

Skills

Leadership

Executive-level communication

Global collaboration

Independent work

Travel readiness

Education

Bachelor's degree in Engineering

Master's degree (preferred)

Job description

Amkor Technology, Inc. in Tempe/Peoria is seeking a strategic VP to lead Advanced Packaging Technology. You will shape roadmaps, engage Tier 1 customers, and drive development across global teams, including Korea R&D, to deliver state-of-the-art IC packaging solutions.

The role requires 15+ years in packaging, strong leadership, and extensive collaboration across engineering, operations, and sales, with travel up to 20% internationally. Based in AZ with global responsibilities.