Sr. Director, Chiplets/FCBGA Integration

Amkor Technology; Tempe (AZ); Hybrid; USD 220,000 - 270,000; Full time

Job summary

Amkor Technology, Inc. in Tempe, AZ seeks a Sr. Director, Chiplets/FCBGA to lead strategy, development, and execution of advanced chiplet-based module technologies including HDFO and other IC package solutions for AI, HPC, and networking markets.

The role interfaces with Tier 1 customers and Amkor's R&D center in South Korea, driving roadmaps, customer engagement, and successful commercialization of next‑gen packaging solutions. 20% domestic and 20% international travel required.

Qualifications

• Bachelor's degree in Engineering (Mechanical Engineering or Materials Science) required; Master's preferred.
• 12+ years of experience in semiconductor packaging development.
• Experience leading advanced packaging programs within a global organization.
• Strong understanding of IC package design environments for FCBGA and heterogeneous module-based packaging.
• Experience with offshore development teams is highly desired.
• Excellent written, verbal, and customer-facing communication skills.
• Willingness to travel 20% domestic and 20% international.

Responsibilities

• Lead advanced IC package development initiatives with customers and Amkor's teams in Korea, aligning solutions with requirements.
• Drive strategic engagement with Tier 1 customers, including technology roadmap discussions and reviews.
• Champion innovation in package architectures, materials, thermal management, warpage control, and heterogeneous integration.
• Lead cross-functional teams across design, materials, simulation, reliability, and process development.
• Guide development from concept through qualification, transfer, and production ramp.
• Identify opportunities to expand Amkor's packaging solutions for AI, HPC, and networks.
• Monitor industry trends to influence product strategy and priorities.
• Manage program objectives, schedules, risks, and customer expectations.

Skills

Semiconductor packaging

Project leadership

Global collaboration

Customer engagement

IC packaging knowledge

Education

Bachelor's degree in Engineering

Master's degree preferred

Job description

Amkor Technology, Inc. (Nasdaq: AMKR) is the world’s largest U.S. headquartered OSAT and is a global leader in outsourced semiconductor packaging and test services. With a strong track record of innovation, a broad and diverse geographic footprint and solid partnerships with lead customers, Amkor delivers high-quality solutions that enable the world’s leading semiconductor and electronics companies to bring advanced technologies to market. The company’s comprehensive portfolio includes advanced packaging, wafer-level processing, and system-in-package solutions targeting applications for smartphones, data centers, artificial intelligence, automobiles and wearables. For more information visit amkor.com .

Position Summary:

Amkor is currently seeking a Sr. Director, Chiplets/FCBGA for our Tempe, AZ office. The primary function of this position is to lead the strategy, development, and execution of advanced chiplet-based module technologies, including HDFO (High Density Fan-Out) and other advanced IC package solutions for AI, computing, networking, and PC client markets. This individual will serve as a key interface with Tier 1 customers and Amkor's leading-edge R&D center in South Korea, driving technology roadmaps, customer engagement, and successful commercialization of next-generation packaging solutions.

Essential Duties and Responsibilities:

• Lead advanced IC package development initiatives with customers and Amkor's development teams in Korea, aligning technical solutions with customer and market requirements.
• Drive strategic engagement with Tier 1 customers, including technology roadmap discussions, development reviews, and executive-level communications.

Champion innovation in package architectures, materials, thermal management, warpage control, and heterogeneous integration technologies.

• Lead cross-functional teams involving package design, materials characterization, simulation, reliability, and process development resources.
• Guide product development from concept through qualification, technology transfer, and production ramp.
• Identify technical and business opportunities to expand Amkor's position in advanced packaging solutions for AI, high-performance computing, and networking applications.
• Monitor industry trends and emerging technologies to influence product strategy and development priorities.
• Manage program objectives, schedules, risks, and customer expectations to achieve successful business outcomes.

Required Qualifications:

• This position requires a Bachelor's degree in Engineering (Mechanical Engineering or Materials Science and/or graduate studies in these disciplines are highly preferred). Master's degree preferred.
• 12+ years of experience in semiconductor packaging development is required.
• Demonstrated experience leading advanced packaging or product development programs within a global organization.
• Strong understanding of IC package design environments and the trade-offs associated with package design for FCBGA and heterogeneous module-based package development.
• Working knowledge of mechanical stress/strain and IC package warpage derived from packaging materials and mechanical configurations.
• Familiarity with Co-Packaged Optics, current trends, and performance drivers.
• Experience influencing technical roadmaps and driving alignment between customer requirements and internal development priorities.
• Previous product or program management experience involving offshore development teams is highly desired.
• Deep knowledge of IC packaging materials, failure modes, and reliability qualification procedures.
• Excellent written, verbal, and customer-facing communication skills.

Ability to work effectively across global organizations and cultures.

• This position requires 20% domestic and 20% international travel.

Preferred Qualifications:

• Demonstrated experience developing package technology roadmaps for AI accelerators, high-performance computing, and data center applications.
• Expertise in Fan-Out IC Packaging, including low-density (LDFO), high-density (HDFO), and bridge-based heterogeneous products.
• Expertise in large-body FCBGA packaging, including warpage control, stress management, underfill, and TIM materials.
• Working knowledge of semi-additive plating chemistries and equipment.
• Familiarity with Design of Experiments (DOE) and Statistical Process Control (SPC).

Location:

Tempe, AZ.This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.