Sr. Director, Chiplets/FCBGA Integration Amkor Technology Advancing What's Next

Semiengineering; Tempe (AZ); Hybrid; USD 180,000 - 250,000; Full time

Job summary

Amkor in Tempe, AZ is seeking a Sr. Director, Chiplets/FCBGA to lead strategy, development, and execution of advanced chiplet-based module technologies for AI, computing, networking, and PCs.

You will interface with Tier 1 customers and Amkor’s R&D center in Korea to drive roadmaps and successful commercialization. You’ll lead cross-functional teams through concept to production ramp while guiding technology directions, performance targets, and reliability goals.

Qualifications

• Bachelor’s degree in Engineering; Master’s preferred.
• Experience leading advanced packaging or product development programs within a global organization.
• Strong understanding of IC package design environments and trade-offs for FCBGA and heterogeneous module-based packaging.

Responsibilities

• Lead advanced IC package development initiatives with customers and development teams.
• Drive strategic engagement with Tier 1 customers on roadmaps and reviews.
• Champion innovation in package architectures, materials, and thermal management.
• Lead cross-functional teams including design, materials, simulation, reliability, and process development.
• Guide product development from concept through qualification, tech transfer, and ramp.
• Identify technical and business opportunities to expand Amkor’s position in AI, HPC, and networking packaging.
• Monitor industry trends to influence product strategy and priorities.
• Manage program objectives, schedules, risks, and customer expectations.

Skills

Communication

Leadership

Global collaboration

Education

Bachelor's degree in Engineering

Master's degree

Job description

Position Summary:

Amkor is currently seeking a Sr. Director, Chiplets/FCBGA for our Tempe, AZ office. The primary function of this position is to lead the strategy, development, and execution of advanced chiplet-based module technologies, including HDFO (High Density Fan-Out) and other advanced IC package solutions for AI, computing, networking, and PC client markets. This individual will serve as a key interface with Tier 1 customers and Amkor’s leading-edge R&D center in South Korea, driving technology roadmaps, customer engagement, and successful commercialization of next-generation packaging solutions.

Essential Duties and Responsibilities:

• Lead advanced IC package development initiatives with customers and Amkor’s development teams in Korea, aligning technical solutions with customer and market requirements.
• Drive strategic engagement with Tier 1 customers, including technology roadmap discussions, development reviews, and executive-level communications.
• Champion innovation in package architectures, materials, thermal management, warpage control, and heterogeneous integration technologies.
• Lead cross-functional teams involving package design, materials characterization, simulation, reliability, and process development resources.
• Guide product development from concept through qualification, technology transfer, and production ramp.
• Identify technical and business opportunities to expand Amkor’s position in advanced packaging solutions for AI, high-performance computing, and networking applications.
• Monitor industry trends and emerging technologies to influence product strategy and development priorities.
• Manage program objectives, schedules, risks, and customer expectations to achieve successful business outcomes.

Required Qualifications:

• This position requires a Bachelor’s degree in Engineering (Mechanical Engineering or Materials Science and/or graduate studies in these disciplines are highly preferred). Master’s degree preferred.
• 12+ years of experience in semiconductor packaging development is required.
• Demonstrated experience leading advanced packaging or product development programs within a global organization.
• Strong understanding of IC package design environments and the trade-offs associated with package design for FCBGA and heterogeneous module-based package development.
• Working knowledge of mechanical stress/strain and IC package warpage derived from packaging materials and mechanical configurations.
• Familiarity with Co-Packaged Optics, current trends, and performance drivers.
• Experience influencing technical roadmaps and driving alignment between customer requirements and internal development priorities.
• Previous product or program management experience involving offshore development teams is highly desired.
• Deep knowledge of IC packaging materials, failure modes, and reliability qualification procedures.
• Excellent written, verbal, and customer-facing communication skills.
• Ability to work effectively across global organizations and cultures.
• This position requires 20% domestic and 20% international travel.

Preferred Qualifications:

• Demonstrated experience developing package technology roadmaps for AI accelerators, high-performance computing, and data center applications.
• Expertise in Fan-Out IC Packaging, including low-density (LDFO), high-density (HDFO), and bridge-based heterogeneous products.
• Expertise in large-body FCBGA packaging, including warpage control, stress management, underfill, and TIM materials.
• Working knowledge of semi-additive plating chemistries and equipment.
• Familiarity with Design of Experiments (DOE) and Statistical Process Control (SPC).

Location:

Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.