Senior Director, Chiplet Packaging & HDFO Strategy

MIcro-Precision Technologies; Tempe (AZ); Hybrid; USD 180,000 - 240,000; Full time

Job summary

Amkor Technology in Tempe, AZ, seeks a Sr. Director, Chiplets/FCBGA to lead the strategy, development and execution of advanced chiplet-based packaging solutions for AI, HPC, networking, and PC markets. You will drive roadmaps and commercialization with Tier 1 customers and Amkor's R&D center in Korea.

The role requires 12+ years in semiconductor packaging, a Bachelor's in Engineering (Master's preferred), and strong leadership in global programs, with 20% domestic and 20% international travel.

Qualifications

• Bachelor's in Engineering required; Master's preferred.
• 12+ years in semiconductor packaging development.
• Experience leading packaging programs in global organizations.
• Strong understanding of IC package design environments and trade-offs.

Responsibilities

• Lead advanced IC package development with customers and global teams.
• Drive strategic engagement with Tier 1 customers and executives.
• Champion innovative packaging architectures and materials.
• Lead cross-functional teams across design, materials, simulation, reliability, and process.
• Guide product development from concept to qualification and ramp.
• Identify opportunities to expand Amkor's position in AI/HPC packaging.
• Monitor industry trends to influence strategy and priorities.
• Manage program objectives, schedules, risks, and customer expectations.

Skills

Leadership in packaging programs

Global cross-functional team

Strategic customer engagement

Excellent communication skills

Education

Bachelor's degree in Engineering

Master's degree preferred

Job description

Amkor Technology in Tempe, AZ, seeks a Sr. Director, Chiplets/FCBGA to lead the strategy, development and execution of advanced chiplet-based packaging solutions for AI, HPC, networking, and PC markets. You will drive roadmaps and commercialization with Tier 1 customers and Amkor's R&D center in Korea.

The role requires 12+ years in semiconductor packaging, a Bachelor's in Engineering (Master's preferred), and strong leadership in global programs, with 20% domestic and 20% international travel.