Senior Director, Chiplet Packaging & FCBGA Programs

Amkor Technology, Inc.; Tempe (AZ); Hybrid; USD 180,000 - 240,000; Full time

Job summary

Amkor Technology, Inc. in Tempe, AZ seeks a Senior Director, Chiplets/FCBGA Business Unit to lead a team of BU engineers responsible for program management of advanced packaging solutions, including chiplet-based IC packages, High Density Fan-Out (HDFO), and other advanced package technologies supporting computing, networking, and mobile markets.

This role serves as the primary business unit leader for strategic Tier 1 customer programs, partnering with Amkor's R&D organization in South

Qualifications

• Bachelor's degree in Engineering or related technical discipline.
• Minimum 12 years of semiconductor packaging experience.
• Experience leading complex customer programs and cross-functional teams.

Responsibilities

• Lead a team of BU engineers from R&D to high-volume manufacturing.
• Represent the BU for Tier-1 customer engagements.
• Coordinate package development with customers and R&D.
• Lead reviews, technical discussions, and status meetings.
• Oversee product lifecycle management and capacity planning.

Skills

Leadership

Cross-functional collaboration

Program management

Executive communication

Education

Bachelor's degree in Engineering or related field

Job description

Amkor Technology, Inc. in Tempe, AZ seeks a Senior Director, Chiplets/FCBGA Business Unit to lead a team of BU engineers responsible for program management of advanced packaging solutions, including chiplet-based IC packages, High Density Fan-Out (HDFO), and other advanced package technologies supporting computing, networking, and mobile markets.

This role serves as the primary business unit leader for strategic Tier 1 customer programs, partnering with Amkor's R&D organization in South