Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding)

Micron Technology, Inc.; Boise (ID); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. seeks a Process Integration Lead for Advanced Packaging to guide a team from concept to full-scale manufacturing of 2.5D/3D packaging platforms. You will drive technology development, process integration, and cross-functional collaboration with design, equipment, reliability, and test groups.

You will mentor a high-skilled team while shaping the technology roadmap for next-generation packaging platforms and ensuring successful technology transfer to manufacturing.

Qualifications

• Bachelor’s degree in Materials/Chemical Engineering or related field with 15+ years experience in advanced packaging development.
• Experience with 2.5D/3D stacking, HBM integration, interconnects, underfill, molding, bonding.
• Experience with AI-enabled engineering workflows and automation in semiconductor development.

Responsibilities

• Lead a team for seamless process integration across 2.5D and 3D packaging platforms.
• Develop, optimize, and qualify emerging packaging technologies.
• Improve yield and reliability via defect analysis and data-driven root cause investigation.
• Lead technology transfer from development to manufacturing and coordinate cross-functional teams.
• Warpage modeling and inline metrology validation.

Skills

Team leadership

Advanced packaging development

DOE design of experiments

Data-driven root cause analysis

AI-enabled engineering workflows

Education

Bachelor’s degree in Materials/Chemical Engineering

Master’s degree or PhD (preferred)

Tools

2.5D packaging

3D stacking

HBM integration

TSVs

Hybrid bonding

Job description

Department Intro:

We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here.

Position Overview:

As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next‑generation packaging platforms while mentoring a highly skilled technical team.

Responsibilities:

• Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die‑stacking solutions, and HBM implementation.
• Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules.
• Improve yield, reliability, and performance using defect analysis, electrical and physical characterization, SPC, and data‑driven root cause investigation.
• Lead technology transfer from development to manufacturing, including materials qualification, process readiness, baseline characterization, and validation planning.
• Partner with design, process, equipment, reliability, test, and manufacturing teams to deliver advanced packaging solutions and scale proven methodologies across global organizations.
• Warpage engineering: predict and mitigate wafer/die warpage via modeling, cure‑shrinkage controls, and material/process levers; validate with inline metrology.

Minimum Qualifications:

• Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field with 15+ years of experience to include advanced packaging technology development, 2.5D, 3D stacking, and HBM integration.
• Experience with advanced interconnects, TSVs, die stacking, underfill, molding, bonding, and package integration processes.
• Experience with hybrid bonding integration (W2W/C2W) and HBM‑to‑logic integration, including thermal optimization.
• Experience defining AI‑enabled engineering workflows, developing automation agents, or applying AI tools to semiconductor development.
• Experience leading collaborative technical teams and driving complex engineering programs to completion.

Preferred Qualifications:

• Master’s degree or PhD.
• Experience developing and scaling advanced packaging technologies from research and development through full‑scale manufacturing.
• Expertise in yield analysis, statistical process control, defect reduction, and data‑driven process optimization.
• Experience with warpage modeling, material characterization, and package reliability qualification.
• Author or contributor to technical publications, patents, or industry presentations related to advanced packaging technologies.

Job Profile(s):

Semiconductor Process Eng SMTS - Semiconductor Process Eng DMTS

Relocation Level: TBD

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