Process Integration Engineer - Advanced Packaging (2.5D/3D)

1000 Micron Technology, Inc.; Idaho City (ID); On-site; USD 120,000 - 170,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. is seeking a Process Integration Engineer in Advanced Packaging to drive the development of 2.5D/3D packaging architectures, HBM, and hybrid bonding.

You will work across engineering disciplines to create production-ready solutions and improve yield, performance, and reliability across complex package systems. The role emphasizes cross-functional collaboration, experimental design, and technology transfer to manufacturing.

Qualifications

• Bachelor’s degree in Materials or Chemical Engineering with 8+ years in advanced packaging.
• Experience with 2.5D/3D integration, HBM, and hybrid bonding.
• Experience with TSVs, interconnects, die stacking, and molding/bonding processes.
• Experience with cross-functional engineering programs in a fast-paced development environment.
• Strong data analytics, problem-solving, and reliability focus.

Responsibilities

• Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects.
• Design and execute experiments to qualify materials, process flows, and design rules for new package architectures.
• Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics.
• Drive technology transfer, including process qualification, design rules, material selection, and manufacturing readiness.
• Collaboration with design, process, equipment, reliability, test, and manufacturing teams to deliver high-performance packaging solutions.

Skills

8+ years packaging experience

TSVs & advanced interconnects

Die stacking & molding technologies

Hybrid bonding integration

HBM and logic integration

Thermal optimization

Cross-functional collaboration

Education

Bachelor’s in Materials or Chemical Engineering

Master’s or PhD preferred

Tools

Data analytics

SPC/Analytics software

Job description

Micron Technology, Inc. is seeking a Process Integration Engineer in Advanced Packaging to drive the development of 2.5D/3D packaging architectures, HBM, and hybrid bonding.

You will work across engineering disciplines to create production-ready solutions and improve yield, performance, and reliability across complex package systems. The role emphasizes cross-functional collaboration, experimental design, and technology transfer to manufacturing.