Graduate Process Integration Engineer, Advanced Packaging

Micron Technology, Inc.; United States; On-site; USD 110,000 - 165,000; Full time

Benefits offered by this job

Medical plans

Dental plans

Vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. invites engineers to join the Advanced Packaging Technology Development (APTD) team as a Process Integration Engineer.

You will help develop next‑generation packaging approaches and link technologies for future semiconductor products, working in a collaborative R&D environment with experienced engineers and technical leaders. The role emphasizes process development, technology evaluation, and qualification activities, with hands-on experience in modern semiconductor

Qualifications

• Master's degree or equivalent in engineering/science.
• Knowledge of semiconductor manufacturing and advanced packaging.
• Demonstrated analytical and problem-solving skills.
• Ability to work in a collaborative, multi-functional team and communicate technical concepts clearly.
• Experience with data analysis tools and willingness to learn AI-assisted technologies.

Responsibilities

• Support development, characterization, and integration of packaging and interconnect solutions for next-generation semiconductor products.
• Collaborate with multi-functional engineering teams to analyze process data, solve technical challenges, and improve technology performance.
• Participate in experiments, process evaluations, and technology qualification activities.
• Utilize AI-enabled and data-driven tools to analyze engineering results, identify trends, and support technical decision-making.
• Promote a culture of safety, quality, compliance, and continuous learning.

Skills

Analytical skills

Collaboration

Data analysis tools

Willingness to learn AI

Education

Master's degree or equivalent

Tools

Statistical analysis tools

DoE techniques

AI-enabled technologies

Job description

Micron Technology, Inc. invites engineers to join the Advanced Packaging Technology Development (APTD) team as a Process Integration Engineer.

You will help develop next‑generation packaging approaches and link technologies for future semiconductor products, working in a collaborative R&D environment with experienced engineers and technical leaders. The role emphasizes process development, technology evaluation, and qualification activities, with hands-on experience in modern semiconductor