Process Integration Engineer: 2.5D/3D Packaging & HBM

Micron Technology, Inc.; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical/Dental/Vision plans

Paid time off & holidays

Relocation assistance

Job summary

Micron Technology, Inc. is seeking a Process Integration Engineer for Advanced Packaging to develop and integrate 2.5D/3D architectures, including HBM, and to drive reliability and performance improvements across cross-functional teams.

You will design experiments, qualify materials, and transfer new processes to manufacturing, while addressing wafer warpage and performance optimization in high-volume production environments.

Qualifications

• Bachelors in Materials or Chemical Engineering or related field with 8+ years in advanced packaging.
• Experience with 2.5D/3D integration, HBM, and advanced interconnects.
• Experience with TSVs, die stacking, underfill, molding, bonding, and package integration.
• Experience with hybrid bonding and reliability, including wafer-to-wafer or chip-to-wafer processes.
• Experience supporting cross-functional engineering programs in a fast-paced environment.

Responsibilities

• Develop and optimize advanced packaging technologies including 2.5D/3D integration and HBM.
• Design and execute experiments to qualify materials, process flows, and design rules.
• Analyze yield, performance, and defect data to identify process improvements.
• Drive technology transfer and manufacturing readiness.
• Warpage engineering: model and mitigate; validate with inline metrology.
• Collaborate with design, process, equipment, reliability, test, and manufacturing teams.

Skills

8+ years experience

2.5D/3D integration

HBM integration

Wafer-to-wafer / chip-to-wafer

Cross-functional collaboration

Education

Bachelor’s degree in Materials or Chemical Engineering

Job description

Micron Technology, Inc. is seeking a Process Integration Engineer for Advanced Packaging to develop and integrate 2.5D/3D architectures, including HBM, and to drive reliability and performance improvements across cross-functional teams.

You will design experiments, qualify materials, and transfer new processes to manufacturing, while addressing wafer warpage and performance optimization in high-volume production environments.