Senior Die-Bonding Process Applications Engineer

Finetech; Chandler (AZ); On-site; USD 95,000 - 135,000; Full time

Job summary

Finetech in Chandler, AZ seeks an experienced Semiconductor Process Applications Engineer to support sales teams and customers with sub-micron die bonding technology. You will run product demonstrations, develop processes, and tailor solutions to advanced packaging needs at customer sites.

The role requires hands-on semiconductor manufacturing experience, strong debugging skills, and the ability to train customers and teammates. Domestic and international travel may be necessary.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
• Minimum 3-5 years of experience in semiconductor manufacturing, advanced packaging, or process engineering.
• Proven expertise with die bonding, wire bonding, or related semiconductor assembly equipment.
• Strong understanding of sub-micron process control, wafer-level packaging, and yield optimization.

Responsibilities

• Serve as a technical resource for customers and internal sales teams regarding sub-micron die bonding equipment and applications in leading-edge technologies.
• Conduct product demonstrations, process development trials, and technical presentations to showcase equipment capabilities.
• Collaborate with customers to understand application requirements and develop customized process solutions.
• Support the installation, qualification, and troubleshooting of die bonding equipment at customer sites domestically.
• Provide technical training to customers and internal staff on equipment operation and process optimization.
• Gather customer feedback and work with international engineering teams to drive product improvements and new feature development.
• Prepare and maintain technical documentation, including application notes, process guidelines, and training materials.
• Represent the company at industry events, conferences, and customer meetings as a technical expert.

Skills

Sub-micron Die Bonding

Wafer-level Packaging

Yield Optimization

Semiconductor Manufacturing

Education

Bachelors or Masters in EE/ME/Materials

Tools

Die Bonding Equipment

Wire Bonding Equipment

Job description

Finetech in Chandler, AZ seeks an experienced Semiconductor Process Applications Engineer to support sales teams and customers with sub-micron die bonding technology. You will run product demonstrations, develop processes, and tailor solutions to advanced packaging needs at customer sites.

The role requires hands-on semiconductor manufacturing experience, strong debugging skills, and the ability to train customers and teammates. Domestic and international travel may be necessary.