Semiconductor Process Applications Engineer

Finetech; Chandler (AZ); On-site; USD 95,000 - 135,000; Full time

Job summary

Finetech in Chandler, AZ seeks an experienced Semiconductor Process Applications Engineer to support sales teams and customers with sub-micron die bonding technology. You will run product demonstrations, develop processes, and tailor solutions to advanced packaging needs at customer sites.

The role requires hands-on semiconductor manufacturing experience, strong debugging skills, and the ability to train customers and teammates. Domestic and international travel may be necessary.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
• Minimum 3-5 years of experience in semiconductor manufacturing, advanced packaging, or process engineering.
• Proven expertise with die bonding, wire bonding, or related semiconductor assembly equipment.
• Strong understanding of sub-micron process control, wafer-level packaging, and yield optimization.

Responsibilities

• Serve as a technical resource for customers and internal sales teams regarding sub-micron die bonding equipment and applications in leading-edge technologies.
• Conduct product demonstrations, process development trials, and technical presentations to showcase equipment capabilities.
• Collaborate with customers to understand application requirements and develop customized process solutions.
• Support the installation, qualification, and troubleshooting of die bonding equipment at customer sites domestically.
• Provide technical training to customers and internal staff on equipment operation and process optimization.
• Gather customer feedback and work with international engineering teams to drive product improvements and new feature development.
• Prepare and maintain technical documentation, including application notes, process guidelines, and training materials.
• Represent the company at industry events, conferences, and customer meetings as a technical expert.

Skills

Sub-micron Die Bonding

Wafer-level Packaging

Yield Optimization

Semiconductor Manufacturing

Education

Bachelors or Masters in EE/ME/Materials

Tools

Die Bonding Equipment

Wire Bonding Equipment

Job description

We are seeking an experienced and highly motivated Semiconductor Process Applications Engineer to join our team. We are a leading capital equipment company specializing in sub-micron die bonding solutions for the semiconductor industry. This role is ideal for professionals with several years of hands-on experience in semiconductor manufacturing and advanced packaging processes. The successful candidate will play a key role in supporting our sales team, interfacing with our customers, and driving technical success for our cutting-edge, die-bonding equipment.

Key Responsibilities

• Serve as a technical resource for customers and internal sales teams regarding sub-micron die bonding equipment and applications in leading-edge technologies like quantum computing and brain-machine interface.
• Conduct product demonstrations, process development trials, and technical presentations to showcase equipment capabilities.
• Collaborate with customers to understand application requirements and develop customized process solutions.
• Support the installation, qualification, and troubleshooting of die bonding equipment at customer sites domestically.
• Provide technical training to customers and internal staff on equipment operation and process optimization.
• Gather customer feedback and work with international engineering teams to drive product improvements and new feature development.
• Prepare and maintain technical documentation, including application notes, process guidelines, and training materials.
• Represent the company at industry events, conferences, and customer meetings as a technical expert.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
• Minimum 3-5 years of experience in semiconductor manufacturing, advanced packaging, or process engineering.
• Proven expertise working with die bonding, wire bonding, or related semiconductor assembly equipment.
• Strong understanding of sub-micron process control, wafer-level packaging, and yield optimization.
• Excellent problem-solving skills and the ability to troubleshoot complex hardware and process issues.
• Outstanding communication and interpersonal skills; ability to present technical information clearly to diverse audiences.
• Able to work daily from our office and demo lab in Chandler, AZ. Willingness to travel domestically and internationally as required (up to 30%).

Preferred Skills

• Customer-focused mindset with a proactive approach to solving challenges.
• Team player able to collaborate across departments and with external partners.
• Adaptable and eager to learn about new technologies and industry trends.
• Self-motivated, organized, and able to manage multiple priorities effectively.
• Familiarity with advanced packaging trends such as flip-chip, wafer-level bonding, and heterogeneous integration.

Why Join Us?

Become part of an innovative, close-knit team at the forefront of semiconductor assembly technology. You will have the opportunity to make a tangible impact on the industry, work with cutting-edge equipment, and advance your career in a collaborative environment that offers a competitive salary and a comprehensive benefits package.