Process Engineer: Die-to-Wafer Bonding & Optimization

Applied Materials; Santa Clara (CA); On-site; USD 147,000 - 202,500; Full time

Benefits offered by this job

Supportive work culture for learning and development

Job summary

Applied Materials is seeking a Process Engineer in Santa Clara, CA, to design and optimize manufacturing processes for display and semiconductor technologies. This role involves analyzing data, engaging with customers, and troubleshooting engineering issues.

The ideal candidate will hold an M.S. or Ph.D. in a relevant field and possess hands-on experience with bonding processes and semiconductor equipment. The company offers a supportive culture encouraging personal and professional growth.

Qualifications

• M.S. or Ph.D. in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline.
• In-depth knowledge and hands-on experience in die-to-wafer or wafer-to-wafer bonding.
• Proficiency in statistical analysis and process control (DOE, SPC, JMP).
• Strong problem-solving skills.

Responsibilities

• Develop die‑to‑wafer hybrid bonding processes.
• Integrate D2W bonding with adjacent process modules.
• Design and execute DOE‑driven experiments.
• Own process optimization and drive continuous improvement.

Job description

Applied Materials is seeking a Process Engineer in Santa Clara, CA, to design and optimize manufacturing processes for display and semiconductor technologies. This role involves analyzing data, engaging with customers, and troubleshooting engineering issues.

The ideal candidate will hold an M.S. or Ph.D. in a relevant field and possess hands-on experience with bonding processes and semiconductor equipment. The company offers a supportive culture encouraging personal and professional growth.