Process Development Engineer

Searches @ Wenham Carter; Town of Florida (NY); On-site; USD 90,000 - 120,000; Full time

Job summary

A confidential advanced semiconductor manufacturing site in Florida seeks a Bonding Process Development Engineer to enhance bonding processes for next-generation packaging technologies. This includes developing temporary and permanent bonding processes and collaborating with teams to improve device performance. Candidates should hold a BS in Engineering and have 3+ years' experience in semiconductor process engineering, especially with bonding technologies. Full-time role offers competitive opportunities in a cutting-edge environment.

Qualifications

• 3+ years of experience in semiconductor process engineering.
• Hands-on experience with bonding technologies in MEMS, CMOS, or advanced packaging environments.
• Familiarity with defect feedback loops.

Responsibilities

• Develop and improve temporary and permanent bonding processes.
• Partner with engineering teams for process integration.
• Monitor SPC data and implement corrective actions.

Skills

Bonding technologies

SPC

DOE

Six Sigma

Education

BS in Engineering

Tools

Fab processing tools

Job description

Bonding Process Development Engineer

A confidential advanced semiconductor manufacturing site in Florida is seeking a Bonding Process Development Engineer to support next‑generation advanced packaging and heterogeneous integration technologies. This role focuses on temporary and permanent bonding process development, supporting integrated advanced packaging flows including hybrid bonding, DBI, 2.5D/3D interposers, and fan‑out wafer‑level packaging. U.S. Citizenship is REQUIRED.

What you’ll be doing

• Develop and improve temporary bonding and debonding processes for advanced packaging using spin‑on polymers, laser debond films, and tapes.
• Define, implement, and maintain manual and automated tape application and bonding processes.
• Develop and maintain permanent wafer‑to‑wafer bonding processes, including hybrid bonding / DBI.
• Partner with integration, process, and equipment engineering teams to support end‑to‑end process integration.
• Drive yield and device performance improvements through bonding and integration changes.
• Identify and resolve process marginalities alongside tool and process engineers.
• Monitor in‑line and end‑of‑line SPC data and defect trends, implementing corrective actions where needed.

What we’re looking for

• BS in Engineering with 3+ years of experience.
• 2–4 years of semiconductor process engineering experience.
• Hands‑on experience with bonding technologies (temporary and/or permanent) in MEMS, CMOS, or advanced packaging environments.
• Familiarity with fab processing tools and defect feedback loops.
• Working knowledge of DOE, SPC, and Six Sigma methodologies.

Seniority level

• Mid‑Senior level

Employment type

• Full‑time

Industries

• Semiconductor Manufacturing and Computers & Electronics Manufacturing