Bonding Process Development Engineer for Advanced Packaging

Searches @ Wenham Carter; Town of Florida (NY); On-site; USD 90,000 - 120,000; Full time

Job summary

A confidential advanced semiconductor manufacturing site in Florida seeks a Bonding Process Development Engineer to enhance bonding processes for next-generation packaging technologies. This includes developing temporary and permanent bonding processes and collaborating with teams to improve device performance. Candidates should hold a BS in Engineering and have 3+ years' experience in semiconductor process engineering, especially with bonding technologies. Full-time role offers competitive opportunities in a cutting-edge environment.

Qualifications

• 3+ years of experience in semiconductor process engineering.
• Hands-on experience with bonding technologies in MEMS, CMOS, or advanced packaging environments.
• Familiarity with defect feedback loops.

Responsibilities

• Develop and improve temporary and permanent bonding processes.
• Partner with engineering teams for process integration.
• Monitor SPC data and implement corrective actions.

Skills

Bonding technologies

SPC

DOE

Six Sigma

Education

BS in Engineering

Tools

Fab processing tools

Job description

A confidential advanced semiconductor manufacturing site in Florida seeks a Bonding Process Development Engineer to enhance bonding processes for next-generation packaging technologies. This includes developing temporary and permanent bonding processes and collaborating with teams to improve device performance. Candidates should hold a BS in Engineering and have 3+ years' experience in semiconductor process engineering, especially with bonding technologies. Full-time role offers competitive opportunities in a cutting-edge environment.